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Исследование с помощью TCAD быстродействия субмикронных МОП-структур с неравномерным легированием канала
С. 27–28.
Publication based on the results of:
Khlynov P., Sambursky L. M., Наноиндустрия 2025 Т. 18 № S11-2 (135) С. 848–854
Taking into account the variation in the parameters of SPICE models of semiconductor components in the circuit modeling of electronic components is necessary for a more accurate assessment of the limits of their operability during the design of electronic equipment. This is especially important for equipment designed to operate in conditions other than normal or ...
Added: September 16, 2025
Petrosyants K. O., Kharitonov I. A., Силкин Д. С. et al., Наноиндустрия 2024 Т. 17 № S10-1(128) С. 302–312
The paper considers qualitative estimations of CMOS SRAM Cells sensitivity to SEU performed for technological nodes varying from 90 nm up to 28 nm using verified TCAD-SPICE software tools and models. The process and results of simulations have been presented. The estimations of CMOS SRAM cells hardness to SEU have been confirmed using SRAM measurement ...
Added: September 3, 2024
Petrosyants K. O., Силкин Д. С., Popov D. et al., Известия высших учебных заведений. Электроника 2023 Т. 28 № 6 С. 826–837
С уменьшением размеров транзисторов возникают условия, когда удар одной частицы затрагивает сразу несколько транзисторов в составе ячейки памяти. Вследствие этого при моделировании недостаточно учитывать один транзистор, в который непосредственно попадает частица. В работе рассмотрена полноразмерная 3D-модель двух n-канальных транзисторов, являющихся частью 6T-ячейки памяти, в которую ударяет заряженная частица. Предложен способ моделирования удара частицы, который позволяет ...
Added: January 11, 2024
Petrosyants K. O., Denis S. Silkin, Popov D., Micromachines 2022 Vol. 13 No. 8 Article 1293
A complete comparison for 14 nm FinFET and NWFET with stacked nanowires was carried out. The electrical and thermal performances in two device structures were analyzed based on TCAD simulation results. The electro-thermal TCAD models were calibrated to data measured on 30–7 nm FinFETs and NWFETs. The full set of output electrical device parameters Ion, ...
Added: October 30, 2022
Ismail-zade M. R., В кн.: Спецвыпуск Наноиндустрия. Российский форум "Микроэлектроника-2021". 7-я Научная конференция «Электронная компонентная база и микроэлектронные модули» Сборник тезисовТ. 14. Вып. 7s.: М.: Рекламно-издательский центр "ТЕХНОСФЕРА", 2021. С. 912–913.
Added: November 5, 2021
Petrosyants K. O., Ismail-zade M. R., Sambursky L. M., В кн.: Математическое моделирование в материаловедении электронных компонентов МММЭК–2021.: М.: МАКС Пресс, 2021. С. 117–120.
The possibilities of determining the SPICE model parameters in an extended temperature range were investigated using the three most common commercial extractors IC-CAP, MBP and BSIMProPlus. Comparative estimates of the efficiency of extractors are given on the example of calculating MOSFETs I–V characteristic taking into account the temperatures up to +300°C. ...
Added: November 5, 2021
Petrosyants K. O., Ismail-zade M. R., Sambursky L. M. et al., Наноиндустрия 2020 Т. 13 № S5-2 С. 386–392
Using a universal approach, SPICE models were developed for sub-100 nm MOSFET structures taking into account radiation and low-temperature effects, as well as a procedure for identifying model parameters based on the results of a full-scale/machine experiment. The approach consists of a combination of macromodeling based on the standard model from the SPICE simulator and ...
Added: April 11, 2021
K. O. Petrosyants, D. A. Popov, M. R. Ismail-Zade et al., , in: Проблемы разработки перспективных микро- и наноэлектронных систем (МЭС-2020).Вып. 4.: ИППМ РАН, 2020. P. 2–8.
Two types of the MOSFET models available in commercial versions of TCAD and SPICE simulators are completed with additional equations taking into account radiation effects. The adequacy of the models is demonstrated on two examples 1) 0.2 um and 0.24 um SOI/DSOI MOSFETs considering TID effects and single heavy ion impact, and 2) 28 nm bulk MOSFET, 45 nm and 28 nm ...
Added: December 5, 2020
Petrosyants K. O., Popov D., Russian Microelectronics 2019 Vol. 48 No. 7 P. 467–469
SOI MOSFETs have the worst properties of heat removal from an active region, which negatively
affects the reliability and efficiency of integrated circuits. Using TCAD modeling, we investigate the self-heating
effect in the following structures of deeply submicron MOSFETs with different configurations of buried
oxide: traditional bulk MOSFET, SOI structure, SELBOX structure, partial SOI structure, thin-BOX SOI
structure, UTBB ...
Added: March 24, 2020
Adonin A. S., Petrosyants K. O., Popov D., , in: Proceedings of SPIE 11022. International Conference on Micro- and Nano-Electronics 2018Vol. 11022G.: SPIE, 2019. P. 1–6.
New SOS MOSFET design with the presence of high-resistance undoped silicon of intrinsic conductivity in the channel
region near the source was proposed. 0.75 μm SOS MOSFET with the use of an "insertion" makes it possible to obtain
the transistor with characteristics corresponding to a transistor with 0.5 μm topological channel length. This allows the
factories to produce ...
Added: November 30, 2019
Petrosyants K. O., Popov D., , in: Proceedings of the 2nd International Conference on Microelectronic Devices and Technologies (MicDAT '2019).: Barcelona: International Frequency Sensor Association (IFSA), 2019. P. 24–28.
In this work self-heating effect in SOI MOSFETs with various configuration of buried oxide was investigated using TCAD modeling. The basically electro-thermal transport model built-in to Sentaurus Synopsys tool was complemented by the set of new models for the temperature-dependent physical parameters: thermal conductivities λSi(T), λSiO2(T); oxide and trapped charge densities Nox(T), Nit(T) and others ...
Added: June 4, 2019
Petrosyants K. O., Kozhukhov M., Popov D., , in: 2019 IEEE 22nd International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS).: Cluj: IEEE, 2019. P. 1–4.
A special RAD-THERM version of TCAD subsystem based on Sentaurus Synopsys platform taking into account different types of irradiation (gamma-rays, neutrons, electrons, protons, single events) and external/internal heating effects was developed and validated to forecast the results of natural experiments, and help the designer on with reliability guarantee. The radiation- and temperature-induced faults were modeled ...
Added: May 31, 2019
Petrosyants K. O., Kozhukhov M., Popov D., Наноиндустрия 2018 № 82 С. 404–405
The paper considers a new TCAD Rad model for BJTs and MOSFETs for proton radiation. The equations for radiation-dependent parameters (life time, mobility, surface velocity, traps concentration) have been added in Sentaurus TCAD. The simulation results are in good agreement with experimental data. ...
Added: January 30, 2019
Petrosyants K. O., , in: 24th International Workshop on Thermal Investigations of ICs and Systems (2018).: IEEE, 2018. P. 1–6.
The temperature range of SPICE models of bipolar and MOS transistors is extended from –60°C to +150°C (standard commercial level) to –200°C…+300°C for low/high temperature ICs design. This is done by including additional equations for temperature-dependent parameters, and by connecting additional elements to the device equivalent circuit to take into account the thermal effects. The ...
Added: November 22, 2018
Petrosyants K. O., В кн.: XVII Всероссийская научно-техническая конференция «Электроника, микро- и наноэлектроника»: 14 - 18 мая 2018 года, г. Суздаль, Россия.: М.: НИИСИ РАН, 2018. С. 65–66.
. ...
Added: November 7, 2018
Petrosyants K. O., Popov D., Sambursky L. M. et al., В кн.: XVII Всероссийская научно-техническая конференция «Электроника, микро- и наноэлектроника»: 14 - 18 мая 2018 года, г. Суздаль, Россия.: М.: НИИСИ РАН, 2018. С. 67–68.
. ...
Added: November 7, 2018
Petrosyants K. O., Popov D., Bykov D., Journal of Physics: Conference Series 2019 Vol. 1163 P. 1–6
Quasi-3D model for calculation of radiation leakage currents in modern submicron SOI MOSFET structures is proposed. Instead of the fully 3D modeling is proposed to solve two tasks: 2D modeling of the traditional MOSFET cross-section and 3D modeling of the side parasitic transistor. The radiation-induced leakage current simulation in the 0.35 μm SOI MOSFET structure with ...
Added: October 22, 2018
Petrosyants K. O., Kozhukhov M., Popov D., Sensors and Transducers 2018 Vol. 227 No. 11 P. 42–50
The special library of radiation damage models for physical parameters and electrical characteristics of bipolar and MOS transistor and sensor structures taking into account neutron, gamma and proton irradiation is developed and built-into Sentaurus Synopsys software tool. For different BJTs/HBTs, MOSFETs and radiation sensors the good agreement to simulated and experimental electrical characteristics is achieved. ...
Added: October 22, 2018
Petrosyants K. O., Popov D., Известия высших учебных заведений. Электроника 2018 Т. 23 № 5 С. 521–525
КНИ МОП-транзисторы имеют худшие условия для отвода тепла из рабочей об-ласти, что негативно сказывается на надежности и производительности микро-схем. С помощью TCAD-моделирования исследован эффект саморазогрева в структурах КНИ МОП-транзистора с различной конфигурацией скрытого оксида: традиционная структура на объемном кремнии, структура кремний на изоляторе, структура с «окном» в скрытом оксиде (SELBOX), КНИ-структура с неполным скрытым оксидом ...
Added: October 22, 2018
Petrosyants K. O., Ismail-zade M. R., Sambursky L. M. et al., В кн.: Проблемы разработки перспективных микро- и наноэлектронных систем (МЭС-2018)Вып. 3.: М., Зеленоград: ИППМ РАН, 2018. С. 111–117.
A set of modified compact spice models of field effect transistors is presented: with isolated gate (MOSFET) and with pn junction control (JFET) for circuit simulation in a temperature range of -200°C, which is important for space applications. All models are constructed using the approach combining macromodeling based on the standard models available in the ...
Added: October 21, 2018
Petrosyants K., Popov D., Bykov D., Russian Microelectronics 2018 Vol. 47 No. 7 P. 487–493
The sub-100-nm CMOS process with a high-κ gate dielectric is one of the key technologies for the
fabrication of digital, analog, and RF VLSI circuits and on-chip systems. The influence of ionizing radiation
on 45-nm MOS transistors with a high-κ dielectric fabricated using the bulk-silicon and SOI technologies is
simulated. Effects induced by the substitution of SiO2 with ...
Added: January 30, 2018
Petrosyants K. O., Sambursky L. M., Kharitonov I. A. et al., , in: Proceedings of XV IEEE East-West Design & Test Symposium (EWDTS'2017).: Piscataway: IEEE, 2017. P. 504–511.
In this work features of measurement, processing and analysis of electrical characteristics of MOSFET’s subjected to various kinds of static irradiation (neutron, electron, and -rays) and temperature in the extended high/low ranges are analyzed. As a result a unified (with account for radiation and temperature) automated measurement, parameters extraction and modeling system is developed, which ...
Added: October 29, 2017