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Оценка эффективности применения различных промышленных экстракторов для определения параметров SPICE-моделей субмикронных МОП-транзисторов
С. 912–913.
In book
Т. 14. Вып. 7s. , М.: Рекламно-издательский центр "ТЕХНОСФЕРА", 2021.
Petrosyants K. O., Romanov A., Romashikhin M., IEEE Access 2025 Vol. 13 P. 205412–205427
This article proposes the basic architecture of a hardware-software complex for SPICE model libraries development. Its improvements are proposed by adding support for AI digital twins methodology, FPGA acceleration and inference, as well as additional automation tools. This made it possible to significantly expand the set of basic SPICE models, increase the temperature range, add ...
Added: December 10, 2025
Petrosyants K. O., Kozhukhov M., Popov D. et al., Известия высших учебных заведений. Электроника 2024 Т. 29 № 5 С. 640–657
The operational amplifiers (Op-Amps) are widely used in electronic systems operating under conditions of exposure to ionizing radiation; hence the IC designer has a need to carry out circuit modeling considering radiation factors. The main problem of this method of the Op-Amps simulation is that in SPICE-like programs there are no adequate models of bipolar ...
Added: November 6, 2025
Khlynov P., Sambursky L. M., Наноиндустрия 2025 Т. 18 № S11-2 (135) С. 848–854
Taking into account the variation in the parameters of SPICE models of semiconductor components in the circuit modeling of electronic components is necessary for a more accurate assessment of the limits of their operability during the design of electronic equipment. This is especially important for equipment designed to operate in conditions other than normal or ...
Added: September 16, 2025
Petrosyants K. O., Kharitonov I. A., Тегин М. С., Известия высших учебных заведений. Электроника 2024 Т. 29 № 1 С. 65–78
Большие скачки температуры в структурах мощных полупроводниковых приборов при их включении и выключении существенно снижают надежность работы силовых схем. Широко используемые маршруты электротеплового моделирования тепловых схем имеют ряд недостатков: использование взаимосвязанных Spice-симуляторов электрических цепей и пакета 3D численного моделирования тепловых полей требует детального описания 3D-конструкций и больших затрат компьютерного времени; использование только Spice-подобных симуляторов электрических ...
Added: May 7, 2024
Petrosyants K. O., Силкин Д. С., Popov D. et al., Известия высших учебных заведений. Электроника 2023 Т. 28 № 6 С. 826–837
С уменьшением размеров транзисторов возникают условия, когда удар одной частицы затрагивает сразу несколько транзисторов в составе ячейки памяти. Вследствие этого при моделировании недостаточно учитывать один транзистор, в который непосредственно попадает частица. В работе рассмотрена полноразмерная 3D-модель двух n-канальных транзисторов, являющихся частью 6T-ячейки памяти, в которую ударяет заряженная частица. Предложен способ моделирования удара частицы, который позволяет ...
Added: January 11, 2024
Kharitonov I. A., Kofanov Y. N., Тегин М. С., Наноиндустрия 2023 Т. 16 № S9-1(119) С. 189–196
The paper presents a set of developed software tools to provide joint electro-thermal modeling of power electronic circuits on PCBs using Comsol, SPICE, Asonika-TM software tools. Examples of joint electro-thermal modeling of power electronic circuit on printed circuits have also been presented. ...
Added: May 21, 2023
Харитонов И.А., Белопашенцев А.С., Наноиндустрия 2022 Т. 15 № S8-1(113) С. 195–200
Using the enhanced capabilities of SPICE modeling of CMOS circuits and extended SPICE models of MOSFET with account for aging effects, the paper deals with quantitative estimates of the increased effects of hot carriers and dielectric breakdown on the characteristics of CMOS operational amplifiers, when the minimum size of transistors is reduced from 180 nm ...
Added: July 7, 2022
Petrosyants K. O., Ismail-zade M. R., Kozhukhov M. et al., Наноиндустрия 2022 Т. 15 № S8-1(113) С. 183–194
The paper highlights RAD-THERM-AGING versions of TCAD and SPICE models developed for BiCMOS VLSI components with submicron and nanometer sizes, taking into account various types of radiation effects, temperatures in the wide range of -260...+300°C and aging during long-term operation. ...
Added: July 7, 2022
Ismail-zade M. R., Russian Microelectronics 2021 Vol. 50 No. 7 P. 486–490
The schematic design of electronic devices for harsh environments requires SPICE models of electronic components that take into account the influence of ultralow and ultrahigh ambient temperatures. However, the standard SPICE models of components in commercial versions of SPICE-like simulators provide sufficient accuracy in a limited temperature range (–60 to 150°С) and cannot be used ...
Added: January 14, 2022
Petrosyants K. O., В кн.: Математическое моделирование в материаловедении электронных компонентов МММЭК–2021.: М.: МАКС Пресс, 2021. С. 112–116.
Added: November 30, 2021
Kozhukhov M., Мухаметдинова А. Р., Проблемы разработки перспективных микро- и наноэлектронных систем (МЭС) 2021 № 4 С. 81–85
A SPICE macromodel of the SiGe HBTs taking into account aging effects is presented. It consists of the standard core model selected by the designer and an additional subcircuit taking into account the hot-carrier effects. The macromodel was included on SPICE-like simulators. The advantages of SPICE-model version of SiGe HBT are high accuracy of description for device ...
Added: November 15, 2021
Petrosyants K. O., Ismail-zade M. R., Sambursky L. M., В кн.: Математическое моделирование в материаловедении электронных компонентов МММЭК–2021.: М.: МАКС Пресс, 2021. С. 117–120.
The possibilities of determining the SPICE model parameters in an extended temperature range were investigated using the three most common commercial extractors IC-CAP, MBP and BSIMProPlus. Comparative estimates of the efficiency of extractors are given on the example of calculating MOSFETs I–V characteristic taking into account the temperatures up to +300°C. ...
Added: November 5, 2021