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Экспериментальное исследование и моделирование ВАХ субмикронных МОП-транзисторов в диапазоне температуры -200…+300°C
С. 67–68.
Petrosyants K. O., Kozhukhov M., Popov D. et al., Известия высших учебных заведений. Электроника 2024 Т. 29 № 5 С. 640–657
The operational amplifiers (Op-Amps) are widely used in electronic systems operating under conditions of exposure to ionizing radiation; hence the IC designer has a need to carry out circuit modeling considering radiation factors. The main problem of this method of the Op-Amps simulation is that in SPICE-like programs there are no adequate models of bipolar ...
Added: November 6, 2025
Федотов А. В., Sambursky L. M., Наноиндустрия 2025 Т. 18 № S11-2(135) С. 859–861
The parameters of the polysilicon—silicon interface in the simulation of thermal processes significantly depend on the choice of the diffusion model available in TCAD. In this paper, based on experimental data, a comparison of the diffusion models available in TCAD in application to these materials is carried out and recommendations for choosing a model are ...
Added: November 5, 2025
Khlynov P., Sambursky L. M., Наноиндустрия 2025 Т. 18 № S11-2 (135) С. 848–854
Taking into account the variation in the parameters of SPICE models of semiconductor components in the circuit modeling of electronic components is necessary for a more accurate assessment of the limits of their operability during the design of electronic equipment. This is especially important for equipment designed to operate in conditions other than normal or ...
Added: September 16, 2025
Petrosyants K. O., Kharitonov I. A., Тегин М. С., Известия высших учебных заведений. Электроника 2024 Т. 29 № 1 С. 65–78
Большие скачки температуры в структурах мощных полупроводниковых приборов при их включении и выключении существенно снижают надежность работы силовых схем. Широко используемые маршруты электротеплового моделирования тепловых схем имеют ряд недостатков: использование взаимосвязанных Spice-симуляторов электрических цепей и пакета 3D численного моделирования тепловых полей требует детального описания 3D-конструкций и больших затрат компьютерного времени; использование только Spice-подобных симуляторов электрических ...
Added: May 7, 2024
Kharitonov I. A., Kofanov Y. N., Тегин М. С., Наноиндустрия 2023 Т. 16 № S9-1(119) С. 189–196
The paper presents a set of developed software tools to provide joint electro-thermal modeling of power electronic circuits on PCBs using Comsol, SPICE, Asonika-TM software tools. Examples of joint electro-thermal modeling of power electronic circuit on printed circuits have also been presented. ...
Added: May 21, 2023
K. O. Petrosyants, D. S. Silkin, D. A. Popov, Russian Microelectronics 2022 Vol. 51 No. 8 P. 644–648
Using TCAD modeling, the effect of changing the FinFET structure parameters, such as gate stack layer sizes, fin shape, or doping levels, on the electrical characteristics of the device is studied. ...
Added: May 13, 2023
K. O. Petrosyants, D. S. Silkin, D. A. Popov et al., Russian Microelectronics 2022 Vol. 51 No. 7 P. 545–551
The transition from planar MOSFET structures to 3D FinFET structures provides resistance to various types of radiation. However, the characteristics of irradiated devices created at different manufacturers differ significantly, and it is rather difficult to explain the dependence of the radiation resistance of FinFE-T structures on variations in their physical and topological parameters and electrical ...
Added: January 30, 2023
Харитонов И.А., Белопашенцев А.С., Наноиндустрия 2022 Т. 15 № S8-1(113) С. 195–200
Using the enhanced capabilities of SPICE modeling of CMOS circuits and extended SPICE models of MOSFET with account for aging effects, the paper deals with quantitative estimates of the increased effects of hot carriers and dielectric breakdown on the characteristics of CMOS operational amplifiers, when the minimum size of transistors is reduced from 180 nm ...
Added: July 7, 2022
Pugach N., Heim D., Seleznev D. V. et al., Superconductor Science and Technology 2022 Vol. 35 Article 025002
We propose a superconducting spin valve based on a Josephson junction with B20-family
magnetic metal as a barrier material. Our analysis shows that the states of this element can be
switched by reorienting the intrinsic non-collinear magnetization of the spiral magnet. This
reorientation modifies long-range spin-triplet correlations and thereby strongly influences the
critical Josephson current. Compared to superconducting spin ...
Added: March 26, 2022
Ismail-zade M. R., В кн.: Спецвыпуск Наноиндустрия. Российский форум "Микроэлектроника-2021". 7-я Научная конференция «Электронная компонентная база и микроэлектронные модули» Сборник тезисовТ. 14. Вып. 7s.: М.: Рекламно-издательский центр "ТЕХНОСФЕРА", 2021. С. 912–913.
Added: November 5, 2021
Petrosyants K. O., Ismail-zade M. R., Sambursky L. M., В кн.: Математическое моделирование в материаловедении электронных компонентов МММЭК–2021.: М.: МАКС Пресс, 2021. С. 117–120.
The possibilities of determining the SPICE model parameters in an extended temperature range were investigated using the three most common commercial extractors IC-CAP, MBP and BSIMProPlus. Comparative estimates of the efficiency of extractors are given on the example of calculating MOSFETs I–V characteristic taking into account the temperatures up to +300°C. ...
Added: November 5, 2021
Petrosyants K. O., Силкин Д. С., Popov D., В кн.: Математическое моделирование в материаловедении электронных компонентов МММЭК–2021.: М.: МАКС Пресс, 2021. С. 120–123.
In this work, the influence of changes in the FinFET structure parameters, such as the dimensions of the gate stack layers, the shape of the fin or doping levels, on the electrical characteristics of the device is investigated with the TCAD modeling. ...
Added: October 31, 2021
Petrosyants K. O., Силкин Д. С., Popov D., В кн.: Проблемы разработки перспективных микро- и наноэлектронных систем – 2021 (МЭС-2021)Вып. 4.: М.: ИППМ РАН, 2021. Гл. 86 С. 2–6.
Added: October 31, 2021
Petrosyants K. O., Силкин Д. С., Popov D., В кн.: Спецвыпуск Наноиндустрия. Российский форум "Микроэлектроника-2021". 7-я Научная конференция «Электронная компонентная база и микроэлектронные модули» Сборник тезисовТ. 14. Вып. 7s.: М.: Рекламно-издательский центр "ТЕХНОСФЕРА", 2021. С. 286–288.
Added: October 31, 2021
Petrosyants K. O., Силкин Д. С., Popov D. et al., Известия высших учебных заведений. Электроника 2021 Т. 26 № 5 С. 374–386
При переходе от планарных структур MOSFET к трехмерным структурам FinFET обеспечивается стойкость к разным видам облучения. Однако характеристики облученных приборов, созданных на разных предприятиях-изготовителях, существенно различаются, и объяснить зависимость радиационной стойкости структур FinFET от вариаций их физико-топологических параметров и электрических режимов достаточно сложно. В работе разработана радиационная версия TCAD-модели МОП-транзистора со структурой FinFET на объемном ...
Added: October 31, 2021
Petrosyants K. O., Ismail-zade M. R., Sambursky L. M. et al., Наноиндустрия 2020 Т. 13 № S5-2 С. 386–392
Using a universal approach, SPICE models were developed for sub-100 nm MOSFET structures taking into account radiation and low-temperature effects, as well as a procedure for identifying model parameters based on the results of a full-scale/machine experiment. The approach consists of a combination of macromodeling based on the standard model from the SPICE simulator and ...
Added: April 11, 2021
Ismail-zade M. R., Sambursky L. M., В кн.: Международный форум «Микроэлектроника-2020». Школа молодых ученых. Сборник тезисов. Республика Крым, г. Ялта, 21-25 сентября 2020 г.: М.: МАКС Пресс, 2020. С. 229–232.
This paper presents Low-T SPICE models of sub-micron MOSFETs, designed to calculate electronic circuits in the cryogenic temperature range (down to 4 K). The procedure for extracting the Low-T SPICE model parameters based on the measurement results or TCAD simulation of a standard set of I-V and C-V characteristics in the cryogenic temperature range has been ...
Added: November 29, 2020
Petrosyants K. O., Popov D., Russian Microelectronics 2019 Vol. 48 No. 7 P. 467–469
SOI MOSFETs have the worst properties of heat removal from an active region, which negatively
affects the reliability and efficiency of integrated circuits. Using TCAD modeling, we investigate the self-heating
effect in the following structures of deeply submicron MOSFETs with different configurations of buried
oxide: traditional bulk MOSFET, SOI structure, SELBOX structure, partial SOI structure, thin-BOX SOI
structure, UTBB ...
Added: March 24, 2020