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SPICE Modeling of GaN HEMTs in the Wide Temperature Range (−269°C…+500°C)
P. 1–4.
The temperature range of the core industry standard ASM model for GaN HEMTs is extended from the standard commercial level (−60∘C to+150∘C) to extreme low and high level (−269∘C…+500∘C) for low- and high-temperature ICs design. This is done by including additional equations for temperature-dependent parameters. The good agreement between simulated and measured device characteristics is achieved. The RMS error is not more than 10-20%.
Publication based on the results of:
Konstantin O. Petrosyants, Mamed R. Ismail-zade, Sambursky L. M., , in: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).: IEEE, 2022. P. 1–4.
The temperature range of SPICE models of sub-100 nm FDSOI MOSFETs and FinFETs is extended from the standard commercial level (-60°C to +150 °C) to extreme low and high level (-200 °C … +300 °C) for low/high temperature ICs design. This is done by including additional equations for temperature-dependent parameters, and by connecting additional elements ...
Added: December 15, 2022
Igor Kharitonov, Gleb Klopotov, Valentin Kobyakov et al., , in: Proceedings of 2022 IEEE Moscow Workshop on Electronic and Networking Technologies (MWENT).: M.: IEEE, 2022. P. 1–5.
Added: July 26, 2022
Харитонов И.А., Белопашенцев А.С., Наноиндустрия 2022 Т. 15 № S8-1(113) С. 195–200
Using the enhanced capabilities of SPICE modeling of CMOS circuits and extended SPICE models of MOSFET with account for aging effects, the paper deals with quantitative estimates of the increased effects of hot carriers and dielectric breakdown on the characteristics of CMOS operational amplifiers, when the minimum size of transistors is reduced from 180 nm ...
Added: July 7, 2022
Kharitonov I. A., В кн.: Проблемы разработки перспективных микро- и наноэлектронных систем – 2021 (МЭС-2021)Вып. 2.: ИППМ РАН, 2021. С. 73–80.
Описаны дополнения к стандартным SPICE моделям МОП элементов схем, учитывающие эф-фекты их старения, обусловленные влиянием горячих но-сителей, пробоя диэлектрика и электромиграции. Наборы таких моделей вместе со средствами определения их параметров и средствами SPICE моделирования объ-единены в подсистему SPICE моделирования КМОП схем с учетом факторов старения и оценки параметров надеж-ности и времени бессбойной работы. Приведены примеры ...
Added: June 8, 2022
Kharitonov I. A., Popov D., Рахматуллин Б. А., Наноиндустрия 2020 Т. 13 № S5-2 С. 379–385
The paper deals with SPICE models of varying complexity for analyzing the heavy (nuclear) particles impact on CMOS circuits. For the version of the model that takes into account the influence of the electric bias on the parameters of the current pulse, expressions have been given for evaluating the main model parameters, depending on the ...
Added: April 16, 2021
Petrosyants K. O., Ismail-zade M. R., Sambursky L. M. et al., Наноиндустрия 2020 Т. 13 № S5-2 С. 386–392
Using a universal approach, SPICE models were developed for sub-100 nm MOSFET structures taking into account radiation and low-temperature effects, as well as a procedure for identifying model parameters based on the results of a full-scale/machine experiment. The approach consists of a combination of macromodeling based on the standard model from the SPICE simulator and ...
Added: April 11, 2021
Звягинцев Д. Е., Елисеева А. В., Куликов Н. А. et al., В кн.: Международный форум «Микроэлектроника-2020». Школа молодых ученых. Сборник тезисов. Республика Крым, г. Ялта, 21-25 сентября 2020 г.: М.: МАКС Пресс, 2020. С. 232–235.
Based on the results of measuring the characteristics of CMOS ICs in the dose range up to 0.5 Mrad with an intensity of 0.1 rad/s, the changes in the concentration of defects Nit, Not were calculated, and the parameters of SPICE models of MOS transistors IC were identified. Circuitry modeling made it possible to estimate ...
Added: December 5, 2020
Petrosyants K. O., Kozhukhov M., В кн.: Международный форум «Микроэлектроника-2020». Школа молодых ученых. Сборник тезисов. Республика Крым, г. Ялта, 21-25 сентября 2020 г.: М.: МАКС Пресс, 2020. С. 394–397.
The unified Si BT/SiGe HBT SPICE-model is presented, which allows performing SPICE simulation of integrated circuits that considering the radiation effect. The results of measurements and modeling of electrical characteristics of bipolar transistors before and after exposure to various radiation types are presented. ...
Added: December 5, 2020
Lebedev S. V., Petrosyants K. O., Stahin V. G. et al., Наноиндустрия 2018 № 82 С. 412–414
The paper summarizes requirements to SPICE models, simulation tools, aspects of model parameter extraction for design of low voltage, ultra-low power CMOS ICs. It presents the results of 2NAND circuit (L = 0.35mkm) simulation for supply voltage reduced from 0.7V to 0.3V. Their logical performance capabilities have been shown for the lowest value of supply ...
Added: January 30, 2019
Petrosyants K. O., Наноиндустрия 2018 № 82 С. 402–403
The paper presents a library of radiation and electrothermal BJT and MOSFET VLSI SPICE models. The library contains models for MOSFET, SOI/SOS MOSFET, Si BJT, SeGe HBT taking into account self-heating, high (up to +300°C) and low (up to –200°C) temperatures, the influence of radiation (neutrons, electrons, γ- and X-ray, protons, pulsed radiation, single particles). ...
Added: January 30, 2019
Petrosyants K.O., Kharitonov I.A., , in: Proceedings of IEEE East-West Design & Test Symposium (EWDTS'2018).: IEEE Computer Society, 2018. P. 760–765.
An extended version of MOSFET RAD SPICE model providing combined account for aging and total dose effects is described. The model uses summation of radiation induced (depending on dose rate, irradiation time, electrical bias) oxide and interface traps densities and interface densities produced by hot electrons to calculate MOSFET characteristics. The model was built using ...
Added: October 30, 2018
Petrosyants K.O., Ryabov N.I., Batarueva E.I., , in: Proceedings of IEEE East-West Design & Test Symposium (EWDTS'2018).: IEEE Computer Society, 2018. P. 580–584.
Authors propose a compact SPICE model of LSI interconnections providing high accuracy of simulation in a time domain with considerable reduction of simulation time. Both straight sections of interconnections, bends with angles 90° and 135° and also T-shaped branches of interconnections are considered. The interconnection model in the form of a multilink RC circuit is ...
Added: October 30, 2018
Petrosyants K. O., Kharitonov I. A., Kozhukhov M. et al., , in: 2017 International Workshop on Reliability of Micro- and Nano-Electronic Devices in Harsh Environment” (IWRMN-EDHE 2017).: Institute of Microelectronics of Chinese Academy of Sciences, 2017. P. 1–3.
An efficient approach to simulation of various types of radiation effects in bipolar and MOSFET IC’s using non-specialized SPICE simulators is realized using the developed compact SPICE models of Si BJT’s, SiGe HBT’s, SOI/SOS MOSFET’s and verified in real projects of extremal electronics R&D. ...
Added: October 16, 2017
Petrosyants K. O., Lebedev S., Sambursky L. M. et al., , in: 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). PROCEEDINGS 2017.: Denver: IEEE, 2017. P. 229–234.
Currently, an increasing number of applications are demanding for electronic units capable of operating reliably in the high temperature range: automotive, airplane and space vehicles, geothermal and nuclear energy generation, deep hole drilling [1]–[5]. Today there are two main trends in high-temperature electronics: 1) device sizes scaling for high performance and low-power digital applications (microprocessors, ...
Added: June 9, 2017
Petrosyants K. O., Sambursky L. M., Kharitonov I. A. et al., Measurement Techniques 2017 Vol. 59 No. 10 P. 1104–1111
The specific nature of the process of measuring the electrical characteristics of bipolar and metal-oxidesemiconductor (MOS) transistors subjected to the action of neutron, electron, and gamma irradiation is considered. An automated measurement system is developed. Examples illustrating the use of the system for investigations of the radiation hardness of transistors are presented and the parameters ...
Added: April 17, 2017
Петросянц К. О., Козынко П. А., Рябов Н. И. et al., М.: Солон-Пресс, 2017.
Рассмотрены принципы работы и электрические характеристики биполярных и МОП-транзисторов интегральных схем, базовых элементов цифровой и аналоговой схемотехники, БМК и ПЛМ, микроконтроллеров и микропроцессоров. Описаны методики выполнения лабораторных, расчетных на ЭВМ, курсовых, самостоятельных и др. работ. Пособие предназначено для бакалавров и магистров различных специальностей, изучающих электронику, микроэлектронику и схемотехнику; отдельные разделы могут быть полезными для аспирантов ...
Added: February 28, 2017
Petrosyants K. O., Kharitonov I. A., Gladysheva E. I., , in: Proceedings of 24-th Telecommunications Forum.: Beograd: IEEE Region 8, Telekom Srbija a.d., 2016. P. 1–4.
It is shown that it is necessary to take into account the radiation influence on CMOS IC’s characteristics in the process of waveforms distortions analysis in satellite communication PCB traces. The special SPICE models for CMOS transistors with radiation dependent model parameters were used for this purpose. The simulation results showed that total dose results ...
Added: November 25, 2016
Petrosyants K. O., Kharitonov I. A., Sambursky L. M. et al., , in: Proceedings of the 24th European conference on radiation and its effects on components and systems -2015 (RADECS 2015), Moscow, Russia, 14-18 September.: Piscataway: Institute of Electrical and Electronic Engineers, 2015. P. 23–26.
Added: February 16, 2016
Kharitonov I. A., , in: Science in the modern information society IV: Proceedings of the ConferenceVol. 2.: North Charleston: CreateSpace, 2015. P. 119–121.
The unified SPICE model for MOS FET on insulating substrate with account for the selfheating effects. transistors interaction and thermal properties of chip construction and mounting is presented. The MOS FET model parameters depend on transistor internal temperature which is calculated using thermal network . Any model of MOS FET can be used. Thermal network ...
Added: February 15, 2016