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Extension of the Capabilities of SPICE Analysis Tools for Electro-Thermal Simulation of Power Electronic Circuits

P. 1–5.
Igor Kharitonov, Gleb Klopotov, Valentin Kobyakov, Michael Tegin, Evelina Silchenko, Konstantin Ivlev, Dmytry Loktionov
Language: English
Full text
DOI
Keywords: Electro-thermal simulationSPICE modelsASONIKASPICE simulationthermal feedbackpower componentthermal networkspecial software toolsthermal failures

In book

Proceedings of 2022 IEEE Moscow Workshop on Electronic and Networking Technologies (MWENT)
Proceedings of 2022 IEEE Moscow Workshop on Electronic and Networking Technologies (MWENT)
M.: IEEE, 2022.
Similar publications
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Large temperature jumps in the structures of power semiconductor devices when they are turned on and off significantly reduce the reliability of power circuits. The widely used electrothermal modeling approaches for thermal circuits have a number of disadvantages: the use of interconnected Spice simulators and the numerical 3D thermal field modeling tool requires a detailed description of 3D ...
Added: July 7, 2026
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An extended method for calculating heat transfer coefficients using programs for automated analysis of the thermal regime of TRIANA (ASONIKA-T) radio-electronic equipment for various designs is proposed. Based on the analysis of the obtained heat transfer coefficients, it is shown how to set realistic values for the convective heat transfer coefficient in SOLIDWORKS Simulation and other CAE thermal analysis systems. ...
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The operational amplifiers (Op-Amps) are widely used in electronic systems operating under conditions of exposure to ionizing radiation; hence the IC designer has a need to carry out circuit modeling considering radiation factors. The main problem of this method of the Op-Amps simulation is that in SPICE-like programs there are no adequate models of bipolar ...
Added: November 6, 2025
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A scheme of automated multi-level electro-thermal modeling of power PCB modules using software tools Comsol at the device construction level, SPICE tool at the circuit level, and Asonika-TM tool at board level was  proposed  to  improve  the  conventional  design  approach.  The  effectiveness  of  the proposed methodology is demonstrated in the example of electro-thermal analysis of ...
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The temperature range of the core industry standard ASM model for GaN HEMTs is extended from the standard commercial level (−60∘C to+150∘C) to extreme low and high level (−269∘C…+500∘C) for low- and high-temperature ICs design. This is done by including additional equations for temperature-dependent parameters. The good agreement between simulated and measured device characteristics is achieved. The RMS error is not more ...
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The paper presents a set of developed software tools to provide joint electro-thermal modeling of power electronic circuits on PCBs using Comsol, SPICE, Asonika-TM software tools. Examples of joint electro-thermal modeling of power electronic circuit on printed circuits have also been presented. ...
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The temperature range of SPICE models of sub-100 nm FDSOI MOSFETs and FinFETs is extended from the standard commercial level (-60°C to +150 °C) to extreme low and high level (-200 °C … +300 °C) for low/high temperature ICs design. This is done by including additional equations for temperature-dependent parameters, and by connecting additional elements ...
Added: December 15, 2022
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Added: June 8, 2022
Thermal computer modeling of laser gyros at the design stage: a promising way to improve their quality and increase the economic efficiency of their development and production
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Using a universal approach, SPICE models were developed for sub-100 nm MOSFET structures taking into account radiation and low-temperature effects, as well as a procedure for identifying model parameters based on the results of a full-scale/machine experiment. The approach consists of a combination of macromodeling based on the standard model from the SPICE simulator and ...
Added: April 11, 2021
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