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August 13, 2026
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Analysis of SEU effects in MOSFET and FinFET based 6T SRAM Cells

P. 1–4.
K.O. Petrosyants, D.S. Silkin, D.A. Popov, M.R. Ismail-Zade
Language: English
Full text
DOI
Keywords: TCADFinFETsingle-event upset (SEU)

In book

Proceedings of 2022 IEEE Moscow Workshop on Electronic and Networking Technologies (MWENT)
Proceedings of 2022 IEEE Moscow Workshop on Electronic and Networking Technologies (MWENT)
M.: IEEE, 2022.
Similar publications
TCAD-SPICE Analysis of SEU and Reliability in Space-Grade SRAM from 90 nm to 28 nm
Petrosyants K. O., Kharitonov I. A., Denis S. Silkin, , in: Proceedings of the Future Technologies Conference (FTC) 2025, Volume 3Vol. 3.: Springer Publishing Company, 2026. P. 171–184.
The study presents the results of developing a combined TCAD-SPICE model of the behavior of CMOS memory cells under space impact conditions. The study analyzes both degradation from prolonged cosmic radiation and single-event upsets (SEUs) caused by high-energy particle strikes, which can flip memory states in space-based electronics. The dependence of SEU hardness on cell ...
Added: April 7, 2026
TCAD Electrothermal Analysis of 3D GAAFET Structures for Future VLSI Circuits
Konstantin O. Petrosyants, Denis S. Silkin, Dmitriy A. Popov, , in: Proceedings of the Future Technologies Conference (FTC) 2024, Volume 3. (LNNS, volume 1156).: Switzerland: Springer, 2024. P. 643–652.
Added: November 6, 2025
Высокочастотная модель транзистора со статической индукцией
Максименко Ю. Н., Petrosyants K. O., Силкин Д. С. et al., Известия высших учебных заведений. Электроника 2024 Т. 29 № 6 С. 772–786
Physical and mathematical model of a transistor with static induction makes it possible to calculate the main current-voltage characteristics and to analyze the design of devices for static mode in bipolar operation of transistor, and also to understand the possibilities of crystal design improvement. However, this model does not allow analyzing the operation of devices ...
Added: February 14, 2025
Оценка средствами TCAD стойкости ячеек памяти СОЗУ к воздействию ОЯЧ при уменьшении проектных норм до 28 нм
Petrosyants K. O., Kharitonov I. A., Силкин Д. С. et al., Наноиндустрия 2024 Т. 17 № S10-1(128) С. 302–312
The paper considers qualitative estimations of CMOS SRAM Cells sensitivity to SEU performed for technological nodes varying from 90 nm up to 28 nm using verified TCAD-SPICE software tools and models. The process and results of simulations have been presented. The estimations of CMOS SRAM cells hardness to SEU have been confirmed using SRAM measurement ...
Added: September 3, 2024
Особенности TCAD-SPICE-моделирования удара заряженной частицы в 6T-ячейку статической памяти, изготовленную по КМОП-технологии с проектными нормами 28 нм
Petrosyants K. O., Силкин Д. С., Popov D. et al., Известия высших учебных заведений. Электроника 2023 Т. 28 № 6 С. 826–837
С уменьшением размеров транзисторов возникают условия, когда удар одной частицы затрагивает сразу несколько транзисторов в составе ячейки памяти. Вследствие этого при моделировании недостаточно учитывать один транзистор, в который непосредственно попадает частица. В работе рассмотрена полноразмерная 3D-модель двух n-канальных транзисторов, являющихся частью 6T-ячейки памяти, в которую ударяет заряженная частица. Предложен способ моделирования удара частицы, который позволяет ...
Added: January 11, 2024
Evaluation of the Effect of FinFET Structure Parameters on Electrical Characteristics Using TCAD Modeling Tools
K. O. Petrosyants, D. S. Silkin, D. A. Popov, Russian Microelectronics 2022 Vol. 51 No. 8 P. 644–648
Using TCAD modeling, the effect of changing the FinFET structure parameters, such as gate stack layer sizes, fin shape, or doping levels, on the electrical characteristics of the device is studied. ...
Added: May 13, 2023
TCAD Modeling of Nanoscale FinFET Structures on Bulk Silicon, Taking into Account the Effects of Radiation
K. O. Petrosyants, D. S. Silkin, D. A. Popov et al., Russian Microelectronics 2022 Vol. 51 No. 7 P. 545–551
The transition from planar MOSFET structures to 3D FinFET structures provides resistance to various types of radiation. However, the characteristics of irradiated devices created at different manufacturers differ significantly, and it is rather difficult to explain the dependence of the radiation resistance of FinFE-T structures on variations in their physical and topological parameters and electrical ...
Added: January 30, 2023
Compact SPICE Models of Sub-100 nm FDSOI and FinFET Devices in the Wide Temperature Range (-269°C … + 300°C)
Konstantin O. Petrosyants, Mamed R. Ismail-zade, Sambursky L. M., , in: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).: IEEE, 2022. P. 1–4.
The temperature range of SPICE models of sub-100 nm FDSOI MOSFETs and FinFETs is extended from the standard commercial level (-60°C to +150 °C) to extreme low and high level (-200 °C … +300 °C) for low/high temperature ICs design. This is done by including additional equations for temperature-dependent parameters, and by connecting additional elements ...
Added: December 15, 2022
Comparative Characterization of NWFET and FinFET Transistor Structures Using TCAD Modeling
Petrosyants K. O., Denis S. Silkin, Popov D., Micromachines 2022 Vol. 13 No. 8 Article 1293
A complete comparison for 14 nm FinFET and NWFET with stacked nanowires was carried out. The electrical and thermal performances in two device structures were analyzed based on TCAD simulation results. The electro-thermal TCAD models were calibrated to data measured on 30–7 nm FinFETs and NWFETs. The full set of output electrical device parameters Ion, ...
Added: October 30, 2022
Оценка влияния параметров структуры FinFET на электрические характеристики средствами TCAD-моделирования
Petrosyants K. O., Силкин Д. С., Popov D., В кн.: Математическое моделирование в материаловедении электронных компонентов МММЭК–2021.: М.: МАКС Пресс, 2021. С. 120–123.
In this work, the influence of changes in the FinFET structure parameters, such as the dimensions of the gate stack layers, the shape of the fin or doping levels, on the electrical characteristics of the device is investigated with the TCAD modeling. ...
Added: October 31, 2021
Сравнение тепловых характеристик MOSFET и FinFET
Petrosyants K. O., Силкин Д. С., Popov D., В кн.: Проблемы разработки перспективных микро- и наноэлектронных систем – 2021 (МЭС-2021)Вып. 4.: М.: ИППМ РАН, 2021. Гл. 86 С. 2–6.
Added: October 31, 2021
Проблемы TCAD-моделирования FinFET-структур с учетом радиационных эффектов
Petrosyants K. O., Силкин Д. С., Popov D., В кн.: Спецвыпуск Наноиндустрия. Российский форум "Микроэлектроника-2021". 7-я Научная конференция «Электронная компонентная база и микроэлектронные модули» Сборник тезисовТ. 14. Вып. 7s.: М.: Рекламно-издательский центр "ТЕХНОСФЕРА", 2021. С. 286–288.
Added: October 31, 2021
TCAD-моделирование нанометровых структур FinFET на объемном кремнии с учетом воздействия радиации
Petrosyants K. O., Силкин Д. С., Popov D. et al., Известия высших учебных заведений. Электроника 2021 Т. 26 № 5 С. 374–386
При переходе от планарных структур MOSFET к трехмерным структурам FinFET обеспечивается стойкость к разным видам облучения. Однако характеристики облученных приборов, созданных на разных предприятиях-изготовителях, существенно различаются, и объяснить зависимость радиационной стойкости структур FinFET от вариаций их физико-топологических параметров и электрических режимов достаточно сложно. В работе разработана радиационная версия TCAD-модели МОП-транзистора со структурой FinFET на объемном ...
Added: October 31, 2021
TCAD and SPICE Models for Account of Radiation Effects in Nanoscale MOSFET Structures
K. O. Petrosyants, D. A. Popov, M. R. Ismail-Zade et al., , in: Проблемы разработки перспективных микро- и наноэлектронных систем (МЭС-2020).Вып. 4.: ИППМ РАН, 2020. P. 2–8.
Two types of the MOSFET models available in commercial versions of TCAD and SPICE simulators are completed with additional equations taking into account radiation effects. The adequacy of the models is demonstrated on two examples 1) 0.2 um and 0.24 um SOI/DSOI MOSFETs considering TID effects and single heavy ion impact, and 2) 28 nm bulk MOSFET, 45 nm and 28 nm ...
Added: December 5, 2020
Simulating the Self-Heating Effect for MOSFETs with Various Configurations of Buried Oxide
Petrosyants K. O., Popov D., Russian Microelectronics 2019 Vol. 48 No. 7 P. 467–469
SOI MOSFETs have the worst properties of heat removal from an active region, which negatively affects the reliability and efficiency of integrated circuits. Using TCAD modeling, we investigate the self-heating effect in the following structures of deeply submicron MOSFETs with different configurations of buried oxide: traditional bulk MOSFET, SOI structure, SELBOX structure, partial SOI structure, thin-BOX SOI structure, UTBB ...
Added: March 24, 2020
I-V- Characteristics Analysis of Betavoltaic Microbatteries Using TCAD Model
Petrosyants K. O., Kharitonov I. A., Pugachev A. et al., Journal of Physics: Conference Series 2019 Vol. 1353 No. 1 P. 1–7
The complete analysis of I-V characteristics and set of basical parameters (Voc, Jsc, Idark, Pmax, η) for betavoltaic silicon batteries under Nickel-63 irradiation in temperature range 213-330 K is carried out using universal physical TCAD model. The standard TCAD optical generation model was adopted for simulation of electron-hole generation for beta particles irradiation. The pn-junction ...
Added: June 10, 2019
Comparison of Self-heating Effect in SOI MOSFETs with Various Configuration of Buried Oxide
Petrosyants K. O., Popov D., , in: Proceedings of the 2nd International Conference on Microelectronic Devices and Technologies (MicDAT '2019).: Barcelona: International Frequency Sensor Association (IFSA), 2019. P. 24–28.
In this work self-heating effect in SOI MOSFETs with various configuration of buried oxide was investigated using TCAD modeling. The basically electro-thermal transport model built-in to Sentaurus Synopsys tool was complemented by the set of new models for the temperature-dependent physical parameters: thermal conductivities λSi(T), λSiO2(T); oxide and trapped charge densities Nox(T), Nit(T) and others ...
Added: June 4, 2019
Radiation- and Temperature-Induced Fault Modeling and Simulation in BiCMOS LSI’s Components using RAD-THERM TCAD Subsystem
Petrosyants K. O., Kozhukhov M., Popov D., , in: 2019 IEEE 22nd International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS).: Cluj: IEEE, 2019. P. 1–4.
A special RAD-THERM version of TCAD subsystem based on Sentaurus Synopsys platform taking into account different types of irradiation (gamma-rays, neutrons, electrons, protons, single events) and external/internal heating effects was developed and validated to forecast the results of natural experiments, and help the designer on with reliability guarantee. The radiation- and temperature-induced faults were modeled ...
Added: May 31, 2019
Обобщенная TCAD-модель для учета радиационных эффектов в структурах МОП и биполярных транзисторов
Petrosyants K. O., Kozhukhov M., Popov D., Наноиндустрия 2018 № 82 С. 404–405
The paper considers a new TCAD Rad model for BJTs and MOSFETs for proton radiation. The equations for radiation-dependent parameters (life time, mobility, surface velocity, traps concentration) have been added in Sentaurus TCAD. The simulation results are in good agreement with experimental data. ...
Added: January 30, 2019
Quasi-3D TCAD modeling of STI radiation-induced leakage currents in SOI MOSFET structure
Petrosyants K. O., Popov D., Bykov D., Journal of Physics: Conference Series 2019 Vol. 1163 P. 1–6
Quasi-3D model for calculation of radiation leakage currents in modern submicron SOI MOSFET structures is proposed.  Instead of the fully 3D modeling is proposed to solve two tasks: 2D modeling of the traditional MOSFET cross-section and 3D modeling of the side parasitic transistor. The radiation-induced leakage current simulation in the 0.35 μm SOI MOSFET structure with ...
Added: October 22, 2018
Effective Radiation Damage Models for TCAD Simulation of Silicon Bipolar and MOS Transistor and Sensor Structures
Petrosyants K. O., Kozhukhov M., Popov D., Sensors and Transducers 2018 Vol. 227 No. 11 P. 42–50
The special library of radiation damage models for physical parameters and electrical characteristics of bipolar and MOS transistor and sensor structures taking into account neutron, gamma and proton irradiation is developed and built-into Sentaurus Synopsys software tool. For different BJTs/HBTs, MOSFETs and radiation sensors the good agreement to simulated and experimental electrical characteristics is achieved. ...
Added: October 22, 2018
Моделирование эффекта саморазогрева КНИ МОП-транзистора с различной конфигурацией скрытого оксида
Petrosyants K. O., Popov D., Известия высших учебных заведений. Электроника 2018 Т. 23 № 5 С. 521–525
КНИ МОП-транзисторы имеют худшие условия для отвода тепла из рабочей об-ласти, что негативно сказывается на надежности и производительности микро-схем. С помощью TCAD-моделирования исследован эффект саморазогрева в структурах КНИ МОП-транзистора с различной конфигурацией скрытого оксида: традиционная структура на объемном кремнии, структура кремний на изоляторе, структура с «окном» в скрытом оксиде (SELBOX), КНИ-структура с неполным скрытым оксидом ...
Added: October 22, 2018
TCAD Simulation of Dose Radiation Effects in Sub-100 nm High-k MOSFET Structures
Petrosyants K., Popov D., Bykov D., Russian Microelectronics 2018 Vol. 47 No. 7 P. 487–493
The sub-100-nm CMOS process with a high-κ gate dielectric is one of the key technologies for the fabrication of digital, analog, and RF VLSI circuits and on-chip systems. The influence of ionizing radiation on 45-nm MOS transistors with a high-κ dielectric fabricated using the bulk-silicon and SOI technologies is simulated. Effects induced by the substitution of SiO2 with ...
Added: January 30, 2018
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