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Оценка влияния параметров структуры FinFET на электрические характеристики средствами TCAD-моделирования
С. 120–123.
In this work, the influence of changes in the FinFET structure parameters, such as the dimensions of the gate stack layers, the shape of the fin or doping levels, on the electrical characteristics of the device is investigated with the TCAD modeling.
In book
М.: МАКС Пресс, 2021.
Petrosyants K. O., Silkin D. S., D. A. Popov et al., Russian Microelectronics 2024 Vol. 53 No. 7 P. 737–743
With a decrease in the size of transistors, the conditions arise when the impact of one particle affects several transistors in the composition of a memory cell. Therefore, during simulation it is not sufficient to take into account one transistor directly hit by a particle. In this study, a full-size 3D model of two n-channel transistors ...
Added: November 6, 2025
Федотов А. В., Sambursky L. M., Наноиндустрия 2025 Т. 18 № S11-2(135) С. 859–861
The parameters of the polysilicon—silicon interface in the simulation of thermal processes significantly depend on the choice of the diffusion model available in TCAD. In this paper, based on experimental data, a comparison of the diffusion models available in TCAD in application to these materials is carried out and recommendations for choosing a model are ...
Added: November 5, 2025
K. O. Petrosyants, D. S. Silkin, D. A. Popov, Russian Microelectronics 2022 Vol. 51 No. 8 P. 644–648
Using TCAD modeling, the effect of changing the FinFET structure parameters, such as gate stack layer sizes, fin shape, or doping levels, on the electrical characteristics of the device is studied. ...
Added: May 13, 2023
K. O. Petrosyants, D. S. Silkin, D. A. Popov et al., Russian Microelectronics 2022 Vol. 51 No. 7 P. 545–551
The transition from planar MOSFET structures to 3D FinFET structures provides resistance to various types of radiation. However, the characteristics of irradiated devices created at different manufacturers differ significantly, and it is rather difficult to explain the dependence of the radiation resistance of FinFE-T structures on variations in their physical and topological parameters and electrical ...
Added: January 30, 2023
Konstantin O. Petrosyants, Mamed R. Ismail-zade, Sambursky L. M., , in: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).: IEEE, 2022. P. 1–4.
The temperature range of SPICE models of sub-100 nm FDSOI MOSFETs and FinFETs is extended from the standard commercial level (-60°C to +150 °C) to extreme low and high level (-200 °C … +300 °C) for low/high temperature ICs design. This is done by including additional equations for temperature-dependent parameters, and by connecting additional elements ...
Added: December 15, 2022
Petrosyants K. O., Denis S. Silkin, Popov D., Micromachines 2022 Vol. 13 No. 8 Article 1293
A complete comparison for 14 nm FinFET and NWFET with stacked nanowires was carried out. The electrical and thermal performances in two device structures were analyzed based on TCAD simulation results. The electro-thermal TCAD models were calibrated to data measured on 30–7 nm FinFETs and NWFETs. The full set of output electrical device parameters Ion, ...
Added: October 30, 2022
K.O. Petrosyants, D.S. Silkin, D.A. Popov et al., , in: Proceedings of 2022 IEEE Moscow Workshop on Electronic and Networking Technologies (MWENT).: M.: IEEE, 2022. P. 1–4.
Added: July 13, 2022
Petrosyants K. O., Силкин Д. С., Popov D., В кн.: Проблемы разработки перспективных микро- и наноэлектронных систем – 2021 (МЭС-2021)Вып. 4.: М.: ИППМ РАН, 2021. Гл. 86 С. 2–6.
Added: October 31, 2021
Petrosyants K. O., Силкин Д. С., Popov D., В кн.: Спецвыпуск Наноиндустрия. Российский форум "Микроэлектроника-2021". 7-я Научная конференция «Электронная компонентная база и микроэлектронные модули» Сборник тезисовТ. 14. Вып. 7s.: М.: Рекламно-издательский центр "ТЕХНОСФЕРА", 2021. С. 286–288.
Added: October 31, 2021
Petrosyants K. O., Силкин Д. С., Popov D. et al., Известия высших учебных заведений. Электроника 2021 Т. 26 № 5 С. 374–386
При переходе от планарных структур MOSFET к трехмерным структурам FinFET обеспечивается стойкость к разным видам облучения. Однако характеристики облученных приборов, созданных на разных предприятиях-изготовителях, существенно различаются, и объяснить зависимость радиационной стойкости структур FinFET от вариаций их физико-топологических параметров и электрических режимов достаточно сложно. В работе разработана радиационная версия TCAD-модели МОП-транзистора со структурой FinFET на объемном ...
Added: October 31, 2021