?
Generation of Hardware Modules for Comparison in Residue Numeral Systems
P. 997–1001.
Svaytodukh S. S., Селиверстов С. В., Applied Physics Letters 2023 Vol. 124 No. 12
Added: May 12, 2024
Романова Д. С., Непомнящий О. В., А. И. Легалов et al., Программная инженерия 2022 Т. 13 № 6 С. 259–271
The problems and solutions in the field of ensuring architectural independence and implementation of digital integrated circuits end-to-end design processes are considered. The paper focuses on the need to find a solution to the problem of program portability during the development of integrated circuits. A review of the main software and tools used to design ...
Added: September 13, 2022
Ivanov F., Krouk E., Kreshchuk A., , in: 2019 XVI International Symposium "Problems of Redundancy in Information and Control Systems" (REDUNDANCY).: IEEE, 2019. P. 133–138.
Added: March 17, 2020
Альбатша А. М., В кн.: Информационные технологии в науке, бизнесе и образовании: сборник трудов X Международной научно-практической конференции студентов, аспирантов и молодых ученых.: М.: Московский государственный лингвистический университет, 2018. С. 11–15.
The aim of this study is to give a brief overview of contemporary approaches (i.e., design/hardware obfuscation techniques) to protecting design (hardware) from various security threats - reverse engineering, IP piracy, tampering. The paper explains the notion ‘design obfuscation' and describes several existing technical solutions for design obfuscation as based on the analysis of academic ...
Added: December 6, 2019
Альбатша А. М., В кн.: Передовые инновационные разработки. Перспективы и опыт использования, проблемы внедрения в производство: сборник научных статей по итогам четвертой международной научной конференцииЧ. 2.: Каз.: [б.и.], 2019. С. 90–92.
The paper presents a brief overview of contemporary approaches to protecting hardware, i.e. design obfuscation techniques, which are meant to counter threats to design IP security ...
Added: December 6, 2019
Lev M. Sambursky, Dmitry A. Parfenov, Mamed R. Ismail-zade et al., , in: Proceedings of IEEE East-West Design & Test Symposium (EWDTS'2018).: IEEE Computer Society, 2018. P. 609–613.
In this work, virtual testing of submicron SOI CMOS reference voltage source integrated circuit was conducted with regard to elevated temperature in the range up to +300°C. Based on simulation results its temperature tolerance figures were estimated. ...
Added: October 30, 2018
Петросянц К. О., Козынко П. А., Рябов Н. И. et al., М.: Солон-Пресс, 2017.
Рассмотрены принципы работы и электрические характеристики биполярных и МОП-транзисторов интегральных схем, базовых элементов цифровой и аналоговой схемотехники, БМК и ПЛМ, микроконтроллеров и микропроцессоров. Описаны методики выполнения лабораторных, расчетных на ЭВМ, курсовых, самостоятельных и др. работ. Пособие предназначено для бакалавров и магистров различных специальностей, изучающих электронику, микроэлектронику и схемотехнику; отдельные разделы могут быть полезными для аспирантов ...
Added: February 28, 2017
Shilov V., Silantiev S., , in: International Communities of Invention and Innovation. IFIP WG 9.7 International Conference on the History of Computing, HC 2016, Brooklyn, NY, USA, May 25-29, 2016, Revised Selected PapersVol. 491.: Cham: Springer, 2016. Ch. 5 P. 71–86.
Paper is devoted to forgotten Russian scholar Semen Korsakov and describes his life and scientific activity. The particular attention is paid to Korsakov’s main achievement – invention of five “intellectual machines”. These machines could be considered as the very first attempt to design a mechanical device capable to perform such intellectual operations as data analysis, ...
Added: December 13, 2016
Petrosyants K. O., Kharitonov I. A., Gladysheva E. I., , in: Proceedings of 24-th Telecommunications Forum.: Beograd: IEEE Region 8, Telekom Srbija a.d., 2016. P. 1–4.
It is shown that it is necessary to take into account the radiation influence on CMOS IC’s characteristics in the process of waveforms distortions analysis in satellite communication PCB traces. The special SPICE models for CMOS transistors with radiation dependent model parameters were used for this purpose. The simulation results showed that total dose results ...
Added: November 25, 2016
Konstantin O. Petrosyants, Sergey V. Lebedev, Sambursky L. M. et al., , in: Proceedings of the 22nd International Workshop on Thermal Investigations of ICs and Systems (Therminic 2016).: IEEE, 2016. P. 250–254.
In this work, results of electrical measurements and their analysis are demonstrated for a small-scale 180-nm SOI CMOS
technology in the extended temperature range (up to 300°C). Comparison with high temperature electrical characteristics
of 0.5 um technology is drawn. Modified model for SOI MOSFETs, based on BSIMSOI model is developed and model
parameters are extracted for SPICE simulation ...
Added: November 1, 2016
Лемешко Н. В., Kechiev L., Zakharova S. S., М.: Грифон, 2016.
Рассматриваются вопросы моделирования электронных средств в задачах обеспечения внутриаппаратурной электромагнитной совместимости, основные программные средства и их возможности при проектировании печатных плат. Впервые в отечественной литературе детально рассмотрены IBIS-модели интегральных микросхем. Описаны ключевые слова и правила составления спецификации IBIS для интегральных компонентов, даны рекомендации по практическому применению IBIS-моделей, в том числе в составе коммерческих пакетов. Значительное ...
Added: May 13, 2016
М.: Техносфера, 2016.
В сборник включены тезисы докладов конференции, освещающие актуалные вопросы разаработки, производства и применения отечественных интегральных схем и высокоинтегрированных микроэлектронных модулей. ...
Added: April 13, 2016
Ivanov I., Korolev P., Polesskiy S. et al., , in: 2016 International Siberian Conference on Control and Communications (SIBCON). Proceedings.: M.: HSE, 2016. P. 1–4.
The paper offers methodology for estimation of durability indices of the modern integrated circuit communication network, which has reports about the conducted tests on non-failure operations and conservability, but has no data for the durability. The paper describes two approaches, which apply for generation of basic data and which allow to receive reliable result, typical ...
Added: April 8, 2016
Rjabov N., Gladysheva E. I., В кн.: Твердотельная электроника. Сложные функциональные блоки РЭА. Материалы XIV научно-технической конференции Москва, 7-9 октября 2015 г.: М.: ОАО НПП «ПУЛЬСАР», 2015. С. 244–247.
Разработано программное обеспечение для анализа задержек в межсоединениях ИС в зависимости от температурных эффектов. Методика численого расчета задержек в межсоединениях позволяет учитывать произвольне распределение температуры в кристаллах. ...
Added: February 5, 2016
Zhadnov V. V., Artyukhova M. A., Надежность 2015 No. 1 P. 19–24
The article deals with forecasting the dependability indicators of state-of-the-art spacecraft onboard equipment. The authors demonstrate the applicability of the results of equipment and components testing for resistance to ionizing radiation in forecasting dependability indicators. They prove the applicability of Alfa distribution of time to failure in forecasting CMOS IC reliability and longevity. The paper ...
Added: January 20, 2015
Zhadnov V. V., Artyukhova M. A., Надежность 2015 № 1 С. 13–18
The article deals with forecasting the dependability indicators of state-of-the-art spacecraft onboard equipment. The authors demonstrate the applicability of the results of equipment and components testing for resistance to ionizing radiation in forecasting dependability indicators. They prove the applicability of Alfa distribution of time to failure in forecasting CMOS IC reliability and longevity. The paper ...
Added: January 20, 2015
Petrosyants K. O., Kharitonov I. A., Rjabov N., Advanced Materials Research 2014 Vol. 918 P. 191–194
An efficient methodology of electro-thermal design of smart power semiconductor
devices and ICs, based on the combined use of SPICE circuit analysis tool and software tools for
2D/3D thermal simulation of IC chip construction, is presented. The features of low, medium and
high power elements, temperature sensors, IC chips simulation are considered ...
Added: October 17, 2014