?
Temperature Characterization of Small-Scale SOI MOSFETs in the Extended Range (to 300°C)
P. 250–254.
Konstantin O. Petrosyants, Sergey V. Lebedev, Sambursky L. M., Veniamin G. Stakhin, Kharitonov I. A.
In this work, results of electrical measurements and their analysis are demonstrated for a small-scale 180-nm SOI CMOS
technology in the extended temperature range (up to 300°C). Comparison with high temperature electrical characteristics
of 0.5 um technology is drawn. Modified model for SOI MOSFETs, based on BSIMSOI model is developed and model
parameters are extracted for SPICE simulation of IC blocks. Results of subsequent SPICE simulation of analog and digital
circuit blocks characteristics are presented. The potential feasibility of using small-scale SOI CMOS technology (180-nm)
for extended temperature range integrated circuits (ICs) is demonstrated.
Petrosyants K. O., Kozhukhov M., Popov D. et al., Известия высших учебных заведений. Электроника 2024 Т. 29 № 5 С. 640–657
The operational amplifiers (Op-Amps) are widely used in electronic systems operating under conditions of exposure to ionizing radiation; hence the IC designer has a need to carry out circuit modeling considering radiation factors. The main problem of this method of the Op-Amps simulation is that in SPICE-like programs there are no adequate models of bipolar ...
Added: November 6, 2025
Khlynov P., Sambursky L. M., Наноиндустрия 2025 Т. 18 № S11-2 (135) С. 848–854
Taking into account the variation in the parameters of SPICE models of semiconductor components in the circuit modeling of electronic components is necessary for a more accurate assessment of the limits of their operability during the design of electronic equipment. This is especially important for equipment designed to operate in conditions other than normal or ...
Added: September 16, 2025
Svaytodukh S. S., Селиверстов С. В., Applied Physics Letters 2023 Vol. 124 No. 12
Added: May 12, 2024
Novikov K., В кн.: «Фундаментальные, поисковые, прикладные исследования и инновационные проекты». Сборник трудов Национальной научно-практической конференции.: М.: РТУ МИРЭА, 2022. С. 261–264.
It is not a trivial task to develop an effective overhead power line short circuit sensor while being restricted on weight, dimensions, power consumption, and the relative position of the sensor and the power line wire. Traditionally, a current transformer similar to a Rogowski coil is used as a sensor, followed up by either a ...
Added: May 21, 2023
Романова Д. С., Непомнящий О. В., А. И. Легалов et al., Программная инженерия 2022 Т. 13 № 6 С. 259–271
The problems and solutions in the field of ensuring architectural independence and implementation of digital integrated circuits end-to-end design processes are considered. The paper focuses on the need to find a solution to the problem of program portability during the development of integrated circuits. A review of the main software and tools used to design ...
Added: September 13, 2022
Харитонов И.А., Белопашенцев А.С., Наноиндустрия 2022 Т. 15 № S8-1(113) С. 195–200
Using the enhanced capabilities of SPICE modeling of CMOS circuits and extended SPICE models of MOSFET with account for aging effects, the paper deals with quantitative estimates of the increased effects of hot carriers and dielectric breakdown on the characteristics of CMOS operational amplifiers, when the minimum size of transistors is reduced from 180 nm ...
Added: July 7, 2022
Kharitonov I. A., В кн.: Проблемы разработки перспективных микро- и наноэлектронных систем – 2021 (МЭС-2021)Вып. 2.: ИППМ РАН, 2021. С. 73–80.
Описаны дополнения к стандартным SPICE моделям МОП элементов схем, учитывающие эф-фекты их старения, обусловленные влиянием горячих но-сителей, пробоя диэлектрика и электромиграции. Наборы таких моделей вместе со средствами определения их параметров и средствами SPICE моделирования объ-единены в подсистему SPICE моделирования КМОП схем с учетом факторов старения и оценки параметров надеж-ности и времени бессбойной работы. Приведены примеры ...
Added: June 8, 2022
Tikhonov E., Sneps-Sneppe M., International Journal of Open Information Technologies 2019 Vol. 7 No. 7 P. 13–26
The article introduces the theoretical foundations of the modern method of storing, transmitting and processing signals: digital processing. It’s a way to use relatively small number of values instead of continuous real signal.
For example, when transmitting information in telephony, speech is concentrated in the bandwidth up to 4 kHz. But we need doubled frequency 8 ...
Added: April 9, 2022
Kozhukhov M., Мухаметдинова А. Р., Проблемы разработки перспективных микро- и наноэлектронных систем (МЭС) 2021 № 4 С. 81–85
A SPICE macromodel of the SiGe HBTs taking into account aging effects is presented. It consists of the standard core model selected by the designer and an additional subcircuit taking into account the hot-carrier effects. The macromodel was included on SPICE-like simulators. The advantages of SPICE-model version of SiGe HBT are high accuracy of description for device ...
Added: November 15, 2021
Dergachev S., Romanov A., Solovyev R., , in: 2021 International Russian Automation Conference (RusAutoCon).: IEEE, 2021. P. 997–1001.
Added: November 12, 2021
Kharitonov I. A., Popov D., Рахматуллин Б. А., Наноиндустрия 2020 Т. 13 № S5-2 С. 379–385
The paper deals with SPICE models of varying complexity for analyzing the heavy (nuclear) particles impact on CMOS circuits. For the version of the model that takes into account the influence of the electric bias on the parameters of the current pulse, expressions have been given for evaluating the main model parameters, depending on the ...
Added: April 16, 2021
Petrosyants K. O., Ismail-zade M. R., Sambursky L. M. et al., Наноиндустрия 2020 Т. 13 № S5-2 С. 386–392
Using a universal approach, SPICE models were developed for sub-100 nm MOSFET structures taking into account radiation and low-temperature effects, as well as a procedure for identifying model parameters based on the results of a full-scale/machine experiment. The approach consists of a combination of macromodeling based on the standard model from the SPICE simulator and ...
Added: April 11, 2021
Petrosyants K. O., Popov D., , in: 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).: IEEE, 2020. P. 56–60.
Added: February 14, 2021
Звягинцев Д. Е., Елисеева А. В., Куликов Н. А. et al., В кн.: Международный форум «Микроэлектроника-2020». Школа молодых ученых. Сборник тезисов. Республика Крым, г. Ялта, 21-25 сентября 2020 г.: М.: МАКС Пресс, 2020. С. 232–235.
Based on the results of measuring the characteristics of CMOS ICs in the dose range up to 0.5 Mrad with an intensity of 0.1 rad/s, the changes in the concentration of defects Nit, Not were calculated, and the parameters of SPICE models of MOS transistors IC were identified. Circuitry modeling made it possible to estimate ...
Added: December 5, 2020
Yelizarov (Elizarov) A. A., Nazarov I., Skuridin A., , in: 14th European Conference on Antennas and Propagation (EuCAP 2020), 15 - 20 March 2020 Copenhagen, Denmark. Catalog number: CFP2077B-ART. ISBN:978-88-31299-00-8.: IEEE, 2020. P. 1–4.
The paper presents the results of computer simulation of electromagnetic wave propagation in a segment of rectangular waveguide that has one of its wide walls made in the form of a mushroom-shaped modulated metastructure. We used electromagnetic simulation program Ansoft HFSS to obtain the field distribution, characteristics of the complex transmission coefficient S 21 and ...
Added: August 20, 2020
Lev M. Sambursky, Mamed R. Ismail-zade, Nina V. Blokhina, , in: 2020 Moscow Workshop on Electronic and Networking Technologies (MWENT).: IEEE, 2020. P. 1–7.
In this paper, we do an early study of circuit parameter variation for temperature-resistant SOI CMOS production technology on the examples of several standard circuit fragments. Circuits electrical characteristics are simulated at several values of temperature (in the range +27…+300 °C) and with account for MOSFET parameter mismatch figures derived from measurement data. The method ...
Added: May 7, 2020
Petrosyants K. O., Popov D., Russian Microelectronics 2019 Vol. 48 No. 7 P. 467–469
SOI MOSFETs have the worst properties of heat removal from an active region, which negatively
affects the reliability and efficiency of integrated circuits. Using TCAD modeling, we investigate the self-heating
effect in the following structures of deeply submicron MOSFETs with different configurations of buried
oxide: traditional bulk MOSFET, SOI structure, SELBOX structure, partial SOI structure, thin-BOX SOI
structure, UTBB ...
Added: March 24, 2020