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Extension of the Capabilities of SPICE Analysis Tools for Electro-Thermal Simulation of Power Electronic Circuits

P. 1–5.
Kharitonov I. A., Тегин М. С., Клопотов Г. И., Сильченко Э. В.

The paper  presents  developed software tools for extension of the capabilities of SPICE analysis tools for electro-thermal simulation of power electronic circuits. The tools provide:  automated circuit elements power definition and temperature-power transfer between circuit and thermal simulation software tools, automated generation of thermal networks for components including heat sink selection. Examples of using only generated thermal network (without electronic circuit) simulation with SPICE software are presented. Such approach allows  to significantly accelerate the electro-thermal simulation process.  Iterative electro-thermal procedure using only SPICE simulation software and thermal networks automatically generated by the developed tool is illustrated and it is shown that it allows to quickly estimate thermal modes of power components and to prevent thermal failures for electronic components.

Language: English
Full text
DOI
Keywords: Electro-thermal simulationSpice modelspower componentthermal networkthermal failure

In book

Proceedings of 2022 IEEE Moscow Workshop on Electronic and Networking Technologies (MWENT)
Proceedings of 2022 IEEE Moscow Workshop on Electronic and Networking Technologies (MWENT)
M.: IEEE, 2022.
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