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News
October 1, 2026
HSE Researchers Show How Congenital Motor Disorders Affect Brain Development
Researchers from HSE University’s Institute for Cognitive Neuroscience have synthesised the findings of their previous studies on brain development in children with obstetric brachial plexus palsy and arthrogryposis. Their analysis shows that impaired motor function in early childhood not only limits children’s motor experience but also affects memory, categorical thinking, and information processing. The study has been published in Frontiers in Psychology.
October 1, 2026
Window into the Body: Scientists Develop Neural Network to Detect Risk of 15 Diseases from Retinal Images
Russian universities, with the participation of HSE University, Sber, and Z-union, have developed a neural network that can simultaneously assess the risk of 15 types of pathology from retinal photographs, including not only eye diseases but also cardiovascular conditions. The AI system can help clinicians detect potentially concerning changes at an early stage, identify signs reflecting the condition of retinal blood vessels, and determine whether a patient may need further examination. The paper has been published in Frontiers in Medicine.
September 30, 2026
'We Did Not Limit the Time for Questions'
The International Laboratory for Supercomputer Atomistic Modelling and Multi-Scale Analysis at HSE University held a major conference on molecular dynamics. Participants had the opportunity to attend all the presentations, while speakers were given as much time as they needed to answer questions. The HSE News Service interviewed Grigory Smirnov, Head of the Laboratory, and Genri Norman, Chief Research Fellow, about the conference preparations and the discussions it generated.

 

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?

Quasi-3D Thermal Simulation of Multi-Chip Stack Embedding Package

P. 1–7.
Konstantin O. Petrosyants, Nikita I. Ryabov

Multi-chip embedded PCBs were in resent years the mainstream technology of electronic packaging size reduction and at the same time providing improved performance. Ultra-small package size obviously strongly impacts the SiP module thermal behaviour. Unfortunately the complete thermal design methodology was not developed for this technology till now. In this work the problem of thermal design is completely solved using quasi-3D approach taking into account the main features of embedded PCB constructions: 1) 3D integration of ICs and board; 2) a large number of thinned layers of different materials; 3) vertical z-axis interconnections through the package layers. A ten times decrease of central processing unit (CPU) time is achieved as compared with the full 3D solutions obtained by commercial universal 3D simulators, while saving the sufficient accuracy. The simulation error of maximal temperature T MAX determination for different types of packages is not more than 10-20%.

Language: English
Full text
DOI
Keywords: temperature distribution computational modelingheating systemsNumerical modelsThree-dimensional displaysSolid modeling

In book

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
IEEE, 2020.
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