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News
July 9, 2026
HSE Economists Use Search Queries to Forecast Birth Rates
Researchers from the HSE Faculty of Economic Sciences have shown that the accuracy of birth rate forecasts for Russia can be improved by almost 50% by incorporating the dynamics of online search queries related to pregnancy and childbirth into forecasting models. In the best-performing models, the forecasting error fell from 4.6% to 3.2%. The findings have been published in Populations and Economics.
July 8, 2026
HSE Researchers Discover Who Eats Out in Russia-And Why
Around one-third of Russians (31.3%) rarely eat out or buy ready-made meals. The core group of active consumers—those who eat out or purchase prepared food almost every day or several times a week—accounts for only about 9% of the population. These are the findings of a study conducted by the HSE Institute for Social Policy. According to the researchers eating out is no longer a marker of high social status in Russia.
July 8, 2026
HSE University and RREDA Join Forces to Support 2026 Renewable Energy of the Planet Competition
HSE University and the Russia Renewable Energy Development Association (RREDA) have signed a partnership and information cooperation agreement to support Renewable Energy of the Planet—2026, a national competition with international participation for students and early-career researchers. Applications are open on the competition's website until September 20, 2026.

 

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?

Quasi-3D Thermal Simulation of Multi-Chip Stack Embedding Package

P. 1–7.
Konstantin O. Petrosyants, Nikita I. Ryabov

Multi-chip embedded PCBs were in resent years the mainstream technology of electronic packaging size reduction and at the same time providing improved performance. Ultra-small package size obviously strongly impacts the SiP module thermal behaviour. Unfortunately the complete thermal design methodology was not developed for this technology till now. In this work the problem of thermal design is completely solved using quasi-3D approach taking into account the main features of embedded PCB constructions: 1) 3D integration of ICs and board; 2) a large number of thinned layers of different materials; 3) vertical z-axis interconnections through the package layers. A ten times decrease of central processing unit (CPU) time is achieved as compared with the full 3D solutions obtained by commercial universal 3D simulators, while saving the sufficient accuracy. The simulation error of maximal temperature T MAX determination for different types of packages is not more than 10-20%.

Language: English
Full text
DOI
Keywords: temperature distribution computational modelingheating systemsNumerical modelsThree-dimensional displaysSolid modeling

In book

2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
IEEE, 2020.
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