Thermo Optical Properties of 3D Photonic Wire Bonding Connecting Silicon Nitride Waveguides

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Thermo Optical Properties of 3D Photonic Wire Bonding Connecting Silicon Nitride Waveguides

P. 908–911.

A. Prokhodtsov, V. Kovalyuk, An P. P., Chubich D., Merkushev D., Kolymagin D., R. Ozhegov, G. Chulkova, Vitukhnovsky A., G. Goltsman

This paper investigates the thermo-optical (TO) effect of misaligned polymer wire bonds (PWB) connecting planar silicon nitride waveguides. To characterize the fabricated de- vices, we measured the optical transmission through PWBs by changing the chip temperature in the range from 30◦C to 80◦C. We used an experimental setup, which included a tunable laser source in the 1510–1620nm range and a changeable temperature stage. By gradually changing the temperature of the sample, we measured the transmission parameter through the reference arm and the arm with PWB. We found that the TO coefficient equals 837pm/◦C, respectively, with the change resonance wavelength. The results can be used to design complex optical inter- connections inside and between chip and show the thermal stability of such interconnection.

Language: English

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Keywords: Photonic integrated circuits (PICs)

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2022 PhotonIcs & Electromagnetics Research Symposium (PIERS), Hangzhou, China, 25–27 April 2022

Hangzhou: IEEE Xplore, 2022.

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