31-th Semiconductor Thermal Measurement, Modeling and Management Symposium,
SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and
systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of
knowledge between thermal engineers, professionals and leading experts from industry as well as the exchange of information on the
latest academic and industrial advances in electronics thermal management.
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of:
1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs.
The actual test validation using IR thermal measurement is demonstrated for all types of components.
We consider the problem of manipulability of social choice rules in the impartial anonymous and neutral culture model (IANC) and provide a new theoretical study of the IANC model, which allows us to analytically derive the difference between the Nitzan-Kelly index in the Impartial Culture (IC) and IANC models. We show in which cases this difference is almost zero, and in which the Nitzan-Kelly index for IANC is the same as for IC. However, in some cases this difference is large enough to cause changes in the relative manipulability of social choice rules. We provide an example of such cases.
This 22nd edition of THERMINIC is again the main European event for academics and industry to share recent advancements in thermal issues of electronics and microelectronics, including problems of nano-scale heat-transfer, thermal modeling and simulation issues in solid-state lighting as well as cooling issues of power electronics.
Following the workshops held in Grenoble (1995), Budapest (1996), Cannes (1997 and 1998), Rome (1999), Budapest (2000), Paris (2001), Madrid (2002), Aix-en-Provence (2003), Sophia Antipolis (2004), Belgirate (2005), Nice (2006), Budapest (2007), Rome (2008), Leuven (2009), Barcelona (2010), Paris (2011), Budapest (2012), Berlin (2013), Greenwhich (2014), and Paris (2015) the workshop is back again to the Hungarian capital, 20 years after THERMINIC was held in Budapest for the first time.
The 22nd THERMINIC Workshop once more proposed a strong technical program. This year’s event had a special focus on advanced thermal management, thermo-mechanical reliability, solid-state lighting and power electronics components – both form design and testing aspects. The Components, Packaging and Manufacturing Technology Society co-sponsored this year‘s workshop, which gathered over 100 attendees from around the world.
Three types of copper traces for PCBs were investigated: 1) 2.5 μm thin film lines (Ti;Cu;Ni) on aluminium and ceramic (Al2O3) substrates; 2) 2.5 μm thin film lines (Ti;Cu;Ni;Au) on ceramic (Al2O3) substrates; 3) 15 μm traces (Cu;Ni) on polyimide substrate for high density interconnection PCBs. The width of all types of traces was varying in the range of 100-500 μm. The set of temperature-current diagrams for different PCB scenarios are presented and analyzed. The temperature caused by Joule heating was measured using IR camera Flir A40 with macrolens. For different cases the current was set in the range of 0.1-3 A; the measured temperature was in the range of 20-140 oC. The close agreement between the results measured and simulated with ELCUT software tool was achieved.
Automated electro-thermal analysis is realized in the last version of Mentor Graphics PCB Design System. The special software tool AETA is developed and integrated into the Expedition Enterprise PCB Design System to automate the process of power-temperature traffic between electrical and thermal simulators. Furthermore AETA provides the graphical user interface and the possibility to use the different versions of Mentor Graphics software.
This 23rd edition of THERMINIC is again the main European event for academics and industry to share recent advances in thermal issues of electronics and microelectronics, including problems of nano-scale heattransfer, thermal modeling and simulation issues in solid-state lighting as well as cooling issues of power electronics. Following the workshops held in Grenoble (1995), Budapest (1996), Cannes (1997 and 1998), Rome (1999), Budapest (2000), Paris (2001), Madrid (2002), Aix-en-Provence (2003), Sophia Antipolis (2004), Belgirate (2005), Nice (2006), Budapest (2007), Rome (2008), Leuven (2009), Barcelona (2010), Paris (2011), Budapest (2012), Berlin (2013), Greenwich (2014), Paris (2015), and Budapest (2016) The 23rd THERMINIC Workshop will once more propose a strong technical program, with 3 keynotes, 52 oral and 17 poster presentations organized in 3 keynote sessions, 12 oral sessions and two poster introduction sessions. More than 120 conference delegates from 23 countries are joining us this year. We look forward to sharing with you a great conference in Amsterdam at THERMINIC 2017.
For the first time in the domestic technical literature questions of designing of system of power delivery network (PDN) of electronic modules of electronic equipment are considered. Noise in the power supply system of high-speed digital modules are one of the basic problems without which decision working capacity of modules cannot be guaranteed. These decisions should be based on deep physical understanding of the processes occurring in the power supply system of digital modules, the analysis of sources of noise and methods of their suppression, the account of features of traditional and new componental base and outcomes, and also specificity of topological designing of multilayered printed-circuit boards. In the book the listed questions are in details considered, the scientifically-proved recommendations on design of printing modules of digital equipment are given. The statement is accompanied by the big number of examples and numerical calculations. The stated material has a practical orientation and is focused, first of all, on developers and designers of electronic equipment. The book will be useful to the technical experts occupied in research, industrial and other spheres of creation of electronic means. It is possible to recommend the edition as the manual to bachelors, masters and post-graduate students of corresponding directions of preparation.
Generalized error-locating codes are discussed. An algorithm for calculation of the upper bound of the probability of erroneous decoding for known code parameters and the input error probability is given. Based on this algorithm, an algorithm for selection of the code parameters for a specified design and input and output error probabilities is constructed. The lower bound of the probability of erroneous decoding is given. Examples of the dependence of the probability of erroneous decoding on the input error probability are given and the behavior of the obtained curves is explained.
The dynamics of a two-component Davydov-Scott (DS) soliton with a small mismatch of the initial location or velocity of the high-frequency (HF) component was investigated within the framework of the Zakharov-type system of two coupled equations for the HF and low-frequency (LF) fields. In this system, the HF field is described by the linear Schrödinger equation with the potential generated by the LF component varying in time and space. The LF component in this system is described by the Korteweg-de Vries equation with a term of quadratic influence of the HF field on the LF field. The frequency of the DS soliton`s component oscillation was found analytically using the balance equation. The perturbed DS soliton was shown to be stable. The analytical results were confirmed by numerical simulations.
Radiation conditions are described for various space regions, radiation-induced effects in spacecraft materials and equipment components are considered and information on theoretical, computational, and experimental methods for studying radiation effects are presented. The peculiarities of radiation effects on nanostructures and some problems related to modeling and radiation testing of such structures are considered.