24th International Workshop on Thermal Investigations of ICs and Systems (2018)

IEEE, 2018.

Academic editor: A. Poppe, S. Volz

This 24th edition of THERMINIC is again the main European event for academics and industry to share recent advances in thermal issues of electronics and microelectronics, including problems of nano-scale heat transfer, thermal modeling and simulation issues in solid-state lighting as well as cooling issues of power electronics.

The 24th THERMINIC Workshop will once more propose a strong technical program. More than 140 scientists from around the world met in Stockholm from September 26-28, 2018 for the 24th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC 2018), making it, again, the largest THERMINIC Workshop in recent history. As usual, the workshop offered a strong scientific program with 3 keynotes, 48 oral and 14 poster presentations organized in 14 oral sessions and two poster introduction sessions.

Chapters

Compact Device Models for BiCMOS VLSIs Simulation in the Extended Temperature Range (from -200°C to +300°C)

Petrosyants K. O., , in: 24th International Workshop on Thermal Investigations of ICs and Systems (2018).: IEEE, 2018. P. 1–6.

The temperature range of SPICE models of bipolar and MOS transistors is extended from –60°C to +150°C (standard commercial level) to –200°C…+300°C for low/high temperature ICs design. This is done by including additional equations for temperature-dependent parameters, and by connecting additional elements to the device equivalent circuit to take into account the thermal effects. The ...

Added: November 22, 2018

Keywords: thermal management, thermo-mechanical reliability, solid-state lighting, power electronics components, тепловые проблемы, термо-механическая надёжность, твердотельные осветительные приборы, мощные электронные компоненты