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Thermal Design System for Chip- and Board-level Electronic Components
P. 247-250.
System for thermal design on chip- and board-level of electronic components is introduced. It is integrated with Mentor Graphics CAD and consists of three subsystems: thermal design in IC Station; thermal design in Expedition PCB; thermal measurement for verification of temperature modeling results.
In book
Х. : Харьковский национальный университет радиоэлектроники, 2009
Petrosyants K. O., Kozynko P., , in : Collection of Papers Presented at the 14th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2008). : Rome : EDA Publishing Association, 2008. P. 76-79.
Automatic electro-thermal analysis is included into Mentor Graphics PCB Design System. The method of simultaneous iteration is used for board-level electro-thermal simulation. New software tool named TransPower is introduced to couple the electrical (Analog Designer) and thermal (BETAsoft) simulators. The design procedure is fully automated, human errors are eliminated, simulation time is significantly decreased, while ...
Added: March 16, 2013
Petrosyants K. O., Rjabov N., Kharitonov I. A. et al., , in : Collection of Papers Presented at the 15th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2009). : Leuven : EDA Publishing Association, 2009. P. 70-74.
New electro-thermal simulation subsystem was introduced into Mentor Graphics IC Design flow. The subsystem incorporates IC thermal simulation tool “Overheat”, dispatcher “ETh SimCoupler” as the simulation manager and layout converter “ETh Model Generator”. Application example of power voltage regulator IC simulation is described. A good agreement between simulated and IR-camera measured temperature pictures is achieved. ...
Added: March 18, 2013
Petrosyants K. O., Kozynko P., , in : Proceedings of IEEE East-West Design & Test Symposium (EWDTS'07). : Kharkov : Kharkov national university of radioelectronics, 2007. P. 599-602.
Automatic electro-thermal analysis is included into Mentor Graphics PCB Design System. New software tool named TransPower is introduced to couple the electrical (Analog Designer) and thermal (BETAsoft) simulators. The design procedure is fully automated, human errors are eliminated, simulation time is significantly decreased, while accuracy and reliability are increased. ...
Added: March 16, 2013
50584562, Kozynko P., Kharitonov I. A. et al., , in : Proceedings of IEEE East-West Design & Test Symposium (EWDTS’12). : Kharkov : Kharkov national university of radioelectronics, 2012. P. 289-292.
Automated electro-thermal analysis is realized in the last version of Mentor Graphics PCB Design System. The special software tool AETA is developed and integrated into the Expedition Enterprise PCB Design System to automate the process of power-temperature traffic between electrical and thermal simulators. Furthermore AETA provides the graphical user interface and the possibility to use ...
Added: December 23, 2012
Kozynko P., В кн. : Проблемы разработки перспективных микро- и наноэлектронных систем – 2008. Сборник научных трудов. : М. : ИППМ РАН, 2008. С. 533-538.
В работе предложены методики и программное обеспечение электротеплового моделирования печатных плат и аналоговых монолитных ИС. Разработаны подсистемы электротеплового моделирования, встроенные в промышленную САПР Mentor Graphics. ...
Added: March 16, 2013
Petrosyants K. O., Ismail-zade M. R., Kozhukhov M. et al., Наноиндустрия 2022 Т. 15 № S8-1(113) С. 183-194
The paper highlights RAD-THERM-AGING versions of TCAD and SPICE models developed for BiCMOS VLSI components with submicron and nanometer sizes, taking into account various types of radiation effects, temperatures in the wide range of -260...+300°C and aging during long-term operation. ...
Added: July 7, 2022
Petrosyants K. O., В кн. : Математическое моделирование в материаловедении электронных компонентов МММЭК–2021. : М. : МАКС Пресс, 2021. С. 112-116.
Added: November 30, 2021
San Jose : the Institute of Electrical and Electronics Engineers, Inc., 2015
SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and
systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of
knowledge between thermal engineers, professionals and leading experts from industry as well as the exchange of information on the
latest academic and ...
Added: March 11, 2016
50584562, Rjabov N., , in : Proceedings of IEEE East-West Design & Test Symposium (EWDTS’11). : Kharkov : Kharkov national university of radioelectronics, 2011. P. 275-278.
New quasi – 3D numerical model for thermal analysis of the BGA packages is presented. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distributions in different layers of the package. The complexity and CPU time of the thermal analysis are many times reduced. The results of ...
Added: April 12, 2012
Petrosyants K. O., Rjabov N., Kharitonov I. A. et al., В кн. : Проблемы разработки перспективных микро- и наноэлектронных систем – 2008. Сборник научных трудов. : М. : ИППМ РАН, 2008. С. 243-246.
В САПР БИС Mentor Graphics встроена подсистема электротеплового моделирования. Подсистема состоит из программы теплового моделирования ИС «Перегрев-МС», программы-диспетчера «ETh SimCoupler», управляющего процессом моделирования, и программы преобразования топологической информации «ETh Model Generator». Рассмотрен пример моделирования мощного интегрального стабилизатора напряжения К142ЕН9. Получено удовлетворительное совпадение результатов моделирования с результатами измерения тепловых полей методом ИК-термографии. ...
Added: March 16, 2013
Petrosyants K. O., Kozynko P., Известия высших учебных заведений. Электроника 2007 № 6 С. 30-38
The automatic electro-thermal simulation has been implemented in Mentor Graphics PCB Design Flow. New program-dispatcher TransPower has been developed to control the electro-thermal calculation process, combining the programs of the electric (Analog Designer) and thermal (BETAsoft) simulation into a single cycle. As a result, the labor consumption and the PCB electro-thermal simulation time have been ...
Added: December 26, 2012
Kulygin V., Zhadnov V. V., В кн. : Инновации на основе информационных и коммуникационных технологий: Материалы международной научно-практической конференции (2015). : М. : НИУ ВШЭ, 2015. С. 513-515.
The structure of the file storing the design data of the program of calculating durability. Algorithms fetch data from the project files as well as the formation of the structure of the device. Conclusions. ...
Added: December 3, 2015
Kharitonov I. A., , in : Proceedings of IEEE East-West Design & Test Symposium (EWDTS’11). : Kharkov : Kharkov national university of radioelectronics, 2011. P. 271-274.
The corrections of the methodology of power BJT and MOSFET transistor models parameter extraction taking into account the self heating effects are presented. For BJT these corrections are included into VBIC model parameter extraction process. For MOSFET current generator connected to standard SPICE MOS model is proposed to take into account drain current growth with ...
Added: April 12, 2012
Kharitonov I. A., В кн. : XVI Всероссийская научно-техническая конференция «Электроника, микро- и наноэлектроника»: 3 - 7 июля 2017 года, г. Суздаль, Россия. : М. : НИИСИ РАН, 2017. С. 64-65.
. ...
Added: September 13, 2017
Kulygin V., Polesskiy S., В кн. : Сборник трудов V Международной научно-практической конференции учащихся и студентов. : Протвино : УЦ Прометей, 2012. С. 522-523.
В материаллах рассматривается программа расчета показателей надежности электронных модулей. ...
Added: December 1, 2014
Kharitonov I. A., , in : Proceedings of the International Scientific – Practical Conference « INFORMATION INNOVATIVE TECHNOLOGIES» (I2T), 2018. : [б.и.], 2018. P. 475-481.
Based on published SOI MOSFETs characteristic changes after TID irradiation in various thermal ambient parameters for electro-thermo-rad SPICE models were defined. Then the models were used for simulation of ring oscillator and single digital CMOS circuit behavior with account for combined thermal and radiation effects. For the case when elevated temperature (up to 200oC) results ...
Added: May 30, 2018
Borisov N., Vostrikov A. V., Kravchenko N. et al., Технологии электромагнитной совместимости 2014 № 4(51) С. 49-57
This article discusses a method of constructing macromodels of linear electrical equivalent circuits in a homogeneous coordinate basis. Here is described in details the method of inversion of a polynomial matrix of the second degree, which is the base of the construction of the macromodel. The method can significantly reduce the complexity of building macromodels ...
Added: October 21, 2014
Kharitonov I. A., В кн. : Проблемы разработки перспективных микро- и наноэлектронных систем (МЭС-2018). Вып. 3.: М., Зеленоград : ИППМ РАН, 2018. С. 103-110.
Using published MOSFETs characteristic degradation after TID irradiation in various thermal ambient parameters of “electro-thermo-rad” SPICE models were defined. Two examples were considered: radiation hardened 2 µm CMOS technology of Sandia National Laboratory and 130 nm CMOS technology. Models were verified using SRAM sell simulation (for 2 µm technology) and voltage reference, ring oscillator and ...
Added: October 23, 2018
Veselova Y. A., Social Choice and Welfare 2016 Vol. 46 No. 3 P. 609-638
We consider the calculation of Nitzan-Kelly’s manipulability index in the impartial anonymous and neutral culture (IANC) model. We provide a new theoretical study of this model and an estimation for the maximal difference between manipulability indices in the IANC model and a basic model, the impartial culture (IC). The asymptotic behavior of this difference is ...
Added: October 30, 2013
М. : Физматлит, 2013
...
Added: November 5, 2014
Petrosyants K. O., Rjabov N., Kharitonov I. A. et al., В кн. : Международная конференция «Микроэлектроника 2015». Сборник тезисов. г.Алушта, Крым, 28 сентября - 3 октября 2015 г. : М. : Техносфера, 2015. С. 231-232.
Описаны разработанные автоматизированные подсистемы, встроенные в коммерческую САПР Mentor Graphics: электротеплового моделирования аналоговых ИС, логико-теплового анализа цифровых ИС и БИС, электротеплового расчета систем на печатных платах. За счет автоматизации процесса электро-теплового и логико-теплового моделирования существенно расширены возможности системы Mentor Graphics. Описаны разработанные электро-тепловые модели компонентов ИС, БИС, проводников печатных плат, используемые в разработанных подсистемах. Приведены ...
Added: February 16, 2016
М. : Техносфера, 2015
В сборник включены тезисы докладов конференции, освещающие актуалные вопросы разаработки, производства и применения отечественных интегральных схем и высокоинтегрированных микроэлектронных модулей. ...
Added: February 16, 2016