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July 24, 2026
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The System for Thermal Control of Electronic Components

P. 150–154.
Petrosyants K. O., Kharitonov I. A., Kozynko P., Rjabov N.

The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monoli­thic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs. The actual test validation through IR thermal measurement is demonstrated for all types of components.

Language: English
Full text
Keywords: тепловая проводимостьVLSIthermal designelectro-thermal designsemiconductor devicesPCBэлектро-тепловое проектированиепечатные платыполупроводниковые приборыnon-stationary heat conductionсубмикронные СБИСтепловизионный анализelectronic CircuitsЭлектронные схемыIR analysisпроектирование с учетом температуры

In book

Proccedings of the International Conference on Advances in Computer Science and Electronics Engineering (CSEE 2014), 08-09 March, 2014, Kuala Lumpur, Malaysia
Proccedings of the International Conference on Advances in Computer Science and Electronics Engineering (CSEE 2014), 08-09 March, 2014, Kuala Lumpur, Malaysia
[б.и.], 2014.
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