Исследование характеристик и определение параметров SPICE-моделей субмикронных КНИ МОПТ в диапазоне температуры до 300°C
In this paper we propose a method of modeling linear equivalent electrical circuit formed by artificial elektroanalogy based on their two-stage reduction. In the first step of the simulation model of each sub-circuit of the initial scheme formally converted into a macro model that reflects only its expressions like "input-output". In the second stage model consisting of macro models, is converted to the next hierarchical level of the macro model. The mathematical apparatus of macro-modeling is based on the inversion in the analytical form of polynomial regular high degree matrices. The proposed method can significantly reduce the complexity of modeling and multivariate analysis of large equivalent electrical circuits.
System for thermal design on chip- and board-level of electronic components is introduced. It is integrated with Mentor Graphics CAD and consists of three subsystems: thermal design in IC Station; thermal design in Expedition PCB; thermal measurement for verification of temperature modeling results.
Are the main features of CAD software used in the development of equipment using FPGA. Is an example of job creation projects FPGA. Discusses some common problems and suggest ways to address them.
The automatic electro-thermal simulation has been implemented in Mentor Graphics PCB Design Flow. New program-dispatcher TransPower has been developed to control the electro-thermal calculation process, combining the programs of the electric (Analog Designer) and thermal (BETAsoft) simulation into a single cycle. As a result, the labor consumption and the PCB electro-thermal simulation time have been significantly reduced, the accuracy and reliability of calculations have been improved and the human errors have been eliminated.
Automatic electro-thermal analysis is included into Mentor Graphics PCB Design System. The method of simultaneous iteration is used for board-level electro-thermal simulation. New software tool named TransPower is introduced to couple the electrical (Analog Designer) and thermal (BETAsoft) simulators. The design procedure is fully automated, human errors are eliminated, simulation time is significantly decreased, while accuracy and reliability are increased.