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Regular version of the site

Book chapter

The System for Thermal Control of Electronic Components

P. 150-154.
Petrosyants K. O., Kharitonov I. A., Kozynko P., Rjabov N.

The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monoli­thic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs. The actual test validation through IR thermal measurement is demonstrated for all types of components.