Моделирование тепловых режимов электронных компонентов
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.
Subsystem ASONIKA-T can operate in standalone mode or as part of ASONIKA in combination with other subsystems. Subsystem ASONIKA-T is designed to automate the modeling of thermal processes such as micro assemblies, radiators, heat-removing bases, hybrid-integrated modules, power cordwood structure, cabinets, racks, and atypical (arbitrary) structures electronics.
This paper presents method that allow to extend computer-aided design of radio-electronic devices and to automate choosing process of thermal regime and temperature control systems for electronic chips and entire device. That process both structural and parametrical optimization is determined as a thermal regime system synthesis. We consider various classes of on-board aerospace and mobile military devices sensitive to mass and dimension. The study proposed a new optimal design criterion of thermal regime systems and suggested mathematical expediency estimation rank for every parameter changing on every optimization step.
The quasi-3D BGA package thermal model is proposed. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distribution in different layers of BGA package construction. It is shown that quasi-3D model provides the reasonable accuracy for standard and thermally enhanced BGAs. The software tool OVERHEAT-BGA is developed to obtain an numerical solution with considerably (6 – 10 times) reduced CPU time in comparison with universal 3D simulators.
The good agreement between designed and measured temperatures for standard and XP BGA packages is achieved.
The automatic electro-thermal simulation has been implemented in Mentor Graphics PCB Design Flow. New program-dispatcher TransPower has been developed to control the electro-thermal calculation process, combining the programs of the electric (Analog Designer) and thermal (BETAsoft) simulation into a single cycle. As a result, the labor consumption and the PCB electro-thermal simulation time have been significantly reduced, the accuracy and reliability of calculations have been improved and the human errors have been eliminated.
Automated electro-thermal analysis is realized in the last version of Mentor Graphics PCB Design System. The special software tool AETA is developed and integrated into the Expedition Enterprise PCB Design System to automate the process of power-temperature traffic between electrical and thermal simulators. Furthermore AETA provides the graphical user interface and the possibility to use the different versions of Mentor Graphics software.