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August 13, 2026
‘Working with AI Solves a Wide Range of Engineering Problems
Artificial intelligence is a working tool based on a balanced combination of algorithms and engineering. Experts and doctoral students from the HSE Moscow Institute of Electronics and Mathematics explain how AI technologies can improve an application, device, or system, and what engineering tasks are solved in the process.
August 12, 2026
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Whatever task Saraa Ali, Junior Research Fellow at the Laboratory of Methods for Big Data Analysis (LAMBDA) of the AI and Digital Science Institute (HSE Faculty of Computer Science), is working on, she thinks about how it can benefit people. She told the Young Scientists of HSE University project about her large family, diagnosing three-phase motors, and her dream of building a children’s home in her native country.
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The Dunning–Kruger effect, which describes a sharp surge in self-confidence among beginners followed by an equally rapid decline as they gain experience, can be explained by the nature of the learning process and the acquisition of new knowledge. This conclusion was reached by Andrey Vorchik of the HSE Faculty of Economic Sciences together with independent researcher Murat Mamyshev. They developed a mathematical model of learning and demonstrated how subjective confidence is formed and changes as knowledge accumulates, as well as how teachers can reduce the ‘valley of despair’ experienced by learners.

 

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?

Thermal Analysis of the Ball Grid Array Packages

P. 275–278.
Petrosyants K., Rjabov N.

New quasi – 3D numerical model for thermal analysis of the BGA packages is presented. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distributions in different layers of the package. The complexity and CPU time of the thermal analysis are many times reduced. The results of BGA package thermal modeling are presented.

Language: English
Full text
Keywords: heat transferthermal effectsтепловые эффектыthermal analysisBGA packagequasi 3D numerical modelquasi 3D approachтрехмерное моделирование тепловых режимовквази трехмерный подходBGA корпусмикросхема

In book

Proceedings of IEEE East-West Design & Test Symposium (EWDTS’11)
Proceedings of IEEE East-West Design & Test Symposium (EWDTS’11)
Kharkov: Kharkov national university of radioelectronics, 2011.
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