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Hardware–Software Complex for SPICE Model Libraries Development
IEEE Access. 2025. Vol. 13. P. 205412–205427.
This article proposes the basic architecture of a hardware-software complex for SPICE model libraries development. Its improvements are proposed by adding support for AI digital twins methodology, FPGA acceleration and inference, as well as additional automation tools. This made it possible to significantly expand the set of basic SPICE models, increase the temperature range, add consideration of radiation exposure, add fault tolerance analysis, increase the level of automation and integration of additional tools, and ensure the storage of various sets of SPICE models of different nature and implementation in a single repository. The advantages of the developed hardware-software complex are demonstrated in various examples of its application for modeling transistors of various types.
Research target:
Electronics and Electrical Engineering
Language:
English
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The electric double layer (EDL) at a single-crystal metal surface is controlled not only by the electrolyte composition and the electrode potential, but also by the atomic structure of the surface itself. This makes the Ag(hkl)/NaF interface a stringent test for continuum theories of the EDL. In the third part of our series, we examine ...
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IEEE Advancing Technology for Humanity, 2025.
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Корсунский В. А., Бяков К. Е., М.: Издательство МГТУ им. Н.Э. Баумана, 2025.
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Уилкокс П., Romanov A., М.: ДМК Пресс, 2025.
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инженера», которая издается при поддержке компании YADRO.
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Edward R. Rzaev, Aleksandr Y. Romanov, Andrey M. Sukhov, IEEE Access 2026 Vol. 14 P. 112184–112201
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by RSC Energia being the leading organization in development of level measuring systems
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extreme measurement bridges with close inductive ...
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Sochi: IEEE, 2026.
2026 International Russian Smart Industry Conference (SmartIndustryCon) Copyright and Reprint Permission: Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limit of U.S. copyright law for private use of patrons those articles in this volume that carry a code at the bottom of the first page, provided the per-copy ...
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IEEE, 2026.
The purpose of the 2026 IEEE Ural-Siberian Conference on Biomedical Engineering, Radioelectronics and Information Technology (USBEREIT) is to bring together researchers and practitioners from multiple areas of radio science, including biomedical engineering, radioelectronics, microelectronics, information technology, smart energy, information security and others. ...
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K. O. Petrosyants, I. A. Kharitonov, Tegin M. S., Russian Microelectronics 2025 Vol. 54 No. 7 P. 743–750
Large temperature jumps in the structures of power semiconductor devices when they are turned
on and off significantly reduce the reliability of power circuits. The widely used electrothermal modeling
approaches for thermal circuits have a number of disadvantages: the use of interconnected Spice simulators
and the numerical 3D thermal field modeling tool requires a detailed description of 3D ...
Added: July 7, 2026
Singapore: Springer, 2026.
This book presents the proceedings of CPESE 2025, the 12th International Conference on Power and Energy Systems Engineering, to be held from 12 to 14 September, 2025 at Kyushu University, Fukuoka, Japan.
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Springer, 2026.
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Методика оценки функциональной безопасности маршрутизаторов на основе вероятностно-физической модели
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