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Regular version of the site

Book chapter

Thermal Analysis of the Ball Grid Array Packages

P. 275-278.
Petrosyants K., Rjabov N.

New quasi – 3D numerical model for thermal analysis of the BGA packages is presented. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distributions in different layers of the package. The complexity and CPU time of the thermal analysis are many times reduced. The results of BGA package thermal modeling are presented.

In book

Thermal Analysis of the Ball Grid Array Packages
Edited by: В. Хаханов. Kharkov: Kharkov national university of radioelectronics, 2011.