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Article

Electro-thermal Design of Smart Power Devices and Integrated Circuits

Advanced Materials Research. 2014. Vol. 918. P. 191-194.

An efficient methodology of electro-thermal design of smart power semiconductor

devices and ICs, based on the combined use of SPICE circuit analysis tool and software tools for

2D/3D thermal simulation of IC chip construction, is presented. The features of low, medium and

high power elements, temperature sensors, IC chips simulation are considered