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News
June 5, 2026
Neural Network Maps as a Method for Constructing Mathematical Models
Scientists from HSE University–Nizhny Novgorod and the Institute of Physics Belgrade, Serbia, are jointly exploring the application of machine learning techniques and neural networks to the study of nonlinear dynamics. Natalya Stankevich, Leading Research Fellow at the Laboratory of Topological Methods in Dynamics of the Faculty of Informatics, Mathematics, and Computer Science at HSE University–Nizhny Novgorod, spoke to the HSE News Service about this international project.
June 5, 2026
‘In the Age of Technology, It Is Interesting to Look into the Past and Think about What We Can Take from It
Polina Tabakova decided to apply for a Philology degree at HSE in Nizhny Novgorod because she grew up in Mari El and did not want to move far away from the Russian forests. In an interview for the Young Scientists of HSE University project, she spoke about the genre of the campus novel, the existential drama of Kolobok, and a blackout version of Eugene Onegin.
June 5, 2026
HSE Scientists Develop Method to Compress Large Language Models Without Losing Quality
Researchers from the AI and Digital Science Institute at the HSE Faculty of Computer Science have developed a new compression method for large language models such as GPT and LLaMA that reduces their size by 25–36% without additional training or significant loss of accuracy. This is the first approach to use mathematical transformations—specifically, rotations of model weights—to make models more amenable to compression with structured matrices. The study results have been published in ACL Findings 2025. The code is available on GitHub.

 

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25th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems (THERMINIC 2019)

Milan : IEEE, 2019.
Under the general editorship: J. Janssen

The 25th THERMINIC Workshop will be held in Lecco, on the shores of Lake Como, Italy. THERMINIC
is the major European Workshop related to thermal issues in electronic components and systems.
For academics and industrialists involved in both micro and power electronics this annual event
promises to be a very special occasion with a high quality technical programme and exciting social
events. We invite delegates to consider submitting abstracts that are related to, but not limited to,
the following topics:
Thermal Phenomena, Simulation and
Experiment
• Thermal management of electronic components
and systems
• Classical and modern thermometry and
thermography
• Multi-physics simulation and field coupling
• Thermal interface materials
• Thermal modelling and investigation of
packages
• Thermal management of power electronics
• High Temperature electronics
• Solid state lighting / LED’s
• Thermal characterisation of micro and nano
domains
• CFD modelling and benchmarking
• Advanced thermal materials
• Heat transfer on the nano-scale
• Thermal performance of interconnects
• Temperature mapping
• Electro-thermal interactions
• Nanotechnology applications
• Flow visualisation
Electronics Cooling Concepts
• Thermo-electric cooling
• Novel and advanced cooling technologies
• Sub-ambient cooling
• Heat pipe assisted cooling
• 3D integration and cooling concepts
• Cooling concepts: air, liquid, etc.
• Ultra low form factor air cooling
• Novel manufacturing methods
• E-vehicle cooling
Thermo-Mechanical Reliability
• Thermo-mechanical reliability
• Prognostics and health monitoring
• Lifetime modelling and prediction
• Damage and fracture mechanics

Chapters
Quasi-3D Thermal Model of Stacked IC-TSV-BGA Package
Petrosyants K. O., Nikita I. Ryabov, , in: 25th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems (THERMINIC 2019).: Milan: IEEE, 2019. Ch. 8923865 P. 1–4.
3D chip stacking technology is now an available option to increase the effective performance of functional modules. Several attempts were made to model the temperature distribution in multichip module packages using universal 3D simulators ABAQUS, FloTHERM, ANSYS, and others. However fully 3D CFD and/or FEA models have some lacks for practical engineers: 1) complex I/O ...
Added: October 29, 2019
Research target: Computer Science Electronics and Electrical Engineering
Priority areas: engineering science
Language: English
Full text
Text on another site
Keywords: electro-thermal effectsтепловые режимы ИМСэлектро-тепловые эффектыthermal mode
25th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems (THERMINIC 2019)
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