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News
July 16, 2026
Team Success: Aligning Means with Objectives
In corporations, sports, and academia, people often face challenges they cannot handle alone. In such cases, selecting the right team is crucial. Tatiana Mayskaya, Associate Professor at the HSE Faculty of Economic Sciences and the International College of Economics and Finance, together with colleagues from foreign universities, examined team characteristics and found that less diverse teams are better suited to objectives where a high average performance is important, whereas more diverse teams are preferable when avoiding failure is critical. The paper has been published in Economic Theory.
July 15, 2026
Economists Propose More Effective Approach to Reducing Smoking
Economists at HSE University have examined how smokers respond to changes in cigarette prices. When tobacco prices increase, cigarette consumption does not always decline. In fact, spending on tobacco may even rise: according to the researchers, a 1% decrease in cigarette affordability leads to a 0.28% increase in per capita tobacco expenditure. The findings suggest that to reduce smoking rates, tobacco prices must rise faster than household incomes. The study has been published in Voprosy Statistiki.
July 15, 2026
HSE MIEM Students to Develop Two Satellites from Scratch for Orbital Experiments
The devices, created by student teams, will conduct space research on the properties of promising solar cells, on-board energy storage systems, and serial electronics for student satellites.

 

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25th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems (THERMINIC 2019)

Milan : IEEE, 2019.
Under the general editorship: J. Janssen

The 25th THERMINIC Workshop will be held in Lecco, on the shores of Lake Como, Italy. THERMINIC
is the major European Workshop related to thermal issues in electronic components and systems.
For academics and industrialists involved in both micro and power electronics this annual event
promises to be a very special occasion with a high quality technical programme and exciting social
events. We invite delegates to consider submitting abstracts that are related to, but not limited to,
the following topics:
Thermal Phenomena, Simulation and
Experiment
• Thermal management of electronic components
and systems
• Classical and modern thermometry and
thermography
• Multi-physics simulation and field coupling
• Thermal interface materials
• Thermal modelling and investigation of
packages
• Thermal management of power electronics
• High Temperature electronics
• Solid state lighting / LED’s
• Thermal characterisation of micro and nano
domains
• CFD modelling and benchmarking
• Advanced thermal materials
• Heat transfer on the nano-scale
• Thermal performance of interconnects
• Temperature mapping
• Electro-thermal interactions
• Nanotechnology applications
• Flow visualisation
Electronics Cooling Concepts
• Thermo-electric cooling
• Novel and advanced cooling technologies
• Sub-ambient cooling
• Heat pipe assisted cooling
• 3D integration and cooling concepts
• Cooling concepts: air, liquid, etc.
• Ultra low form factor air cooling
• Novel manufacturing methods
• E-vehicle cooling
Thermo-Mechanical Reliability
• Thermo-mechanical reliability
• Prognostics and health monitoring
• Lifetime modelling and prediction
• Damage and fracture mechanics

Chapters
Quasi-3D Thermal Model of Stacked IC-TSV-BGA Package
Petrosyants K. O., Nikita I. Ryabov, , in: 25th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems (THERMINIC 2019).: Milan: IEEE, 2019. Ch. 8923865 P. 1–4.
3D chip stacking technology is now an available option to increase the effective performance of functional modules. Several attempts were made to model the temperature distribution in multichip module packages using universal 3D simulators ABAQUS, FloTHERM, ANSYS, and others. However fully 3D CFD and/or FEA models have some lacks for practical engineers: 1) complex I/O ...
Added: October 29, 2019
Research target: Computer Science Electronics and Electrical Engineering
Priority areas: engineering science
Language: English
Full text
Text on another site
Keywords: electro-thermal effectsтепловые режимы ИМСэлектро-тепловые эффектыthermal mode
25th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems (THERMINIC 2019)
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