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25th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems (THERMINIC 2019)
The 25th THERMINIC Workshop will be held in Lecco, on the shores of Lake Como, Italy. THERMINIC
is the major European Workshop related to thermal issues in electronic components and systems.
For academics and industrialists involved in both micro and power electronics this annual event
promises to be a very special occasion with a high quality technical programme and exciting social
events. We invite delegates to consider submitting abstracts that are related to, but not limited to,
the following topics:
Thermal Phenomena, Simulation and
Experiment
• Thermal management of electronic components
and systems
• Classical and modern thermometry and
thermography
• Multi-physics simulation and field coupling
• Thermal interface materials
• Thermal modelling and investigation of
packages
• Thermal management of power electronics
• High Temperature electronics
• Solid state lighting / LED’s
• Thermal characterisation of micro and nano
domains
• CFD modelling and benchmarking
• Advanced thermal materials
• Heat transfer on the nano-scale
• Thermal performance of interconnects
• Temperature mapping
• Electro-thermal interactions
• Nanotechnology applications
• Flow visualisation
Electronics Cooling Concepts
• Thermo-electric cooling
• Novel and advanced cooling technologies
• Sub-ambient cooling
• Heat pipe assisted cooling
• 3D integration and cooling concepts
• Cooling concepts: air, liquid, etc.
• Ultra low form factor air cooling
• Novel manufacturing methods
• E-vehicle cooling
Thermo-Mechanical Reliability
• Thermo-mechanical reliability
• Prognostics and health monitoring
• Lifetime modelling and prediction
• Damage and fracture mechanics