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31-th Semiconductor Thermal Measurement, Modeling and Management Symposium,
San Jose :
the Institute of Electrical and Electronics Engineers, Inc., 2015.
Editor-in-chief: M. Rahima, V. Mulay
Under the general editorship: P. Rodgers
SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and
systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of
knowledge between thermal engineers, professionals and leading experts from industry as well as the exchange of information on the
latest academic and industrial advances in electronics thermal management.
Petrosyants K. O., Torgovnikov R., , in : 31-th Semiconductor Thermal Measurement, Modeling and Management Symposium,. : San Jose : the Institute of Electrical and Electronics Engineers, Inc., 2015. P. 172-175.
Added: March 11, 2016
Research target:
Electronics and Electrical Engineering
Language:
English
Publication based on the results of:
Petrosyants K. O., Kharitonov I. A., Kozynko P. et al., International Journal of Advancements in Electronics and Electrical Engineering (IJAEEE), USA 2014 Vol. 3 No. 2 P. 22-27
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of:
1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs.
The actual test validation using IR thermal measurement is demonstrated for all types of components. ...
Added: October 17, 2014
Petrosyants K. O., Kozynko P., Kharitonov I. A. et al., , in : Proceedings of IEEE East-West Design & Test Symposium (EWDTS’10). : Kharkov : Kharkov national university of radioelectronics, 2010. P. 330-333.
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components. ...
Added: April 12, 2012
IEEE, 2016
This 22nd edition of THERMINIC is again the main European event for academics and
industry to share recent advancements in thermal issues of electronics and microelectronics,
including problems of nano-scale heat-transfer, thermal modeling and
simulation issues in solid-state lighting as well as cooling issues of power electronics.
Following the workshops held in Grenoble (1995), Budapest (1996), Cannes (1997 and
1998), ...
Added: November 1, 2016
Petrosyants K. O., Popov A. A., Advanced Materials Research 2013 Vol. 739 P. 155-160
Three types of copper traces for PCBs were investigated: 1) 2.5 μm thin film lines (Ti;Cu;Ni) on aluminium and ceramic (Al2O3) substrates; 2) 2.5 μm thin film lines (Ti;Cu;Ni;Au) on ceramic (Al2O3) substrates; 3) 15 μm traces (Cu;Ni) on polyimide substrate for high density interconnection PCBs. The width of all types of traces was varying ...
Added: January 23, 2014
Petrosyants K. O., Kharitonov I. A., Kozynko P. et al., , in : Proccedings of the International Conference on Advances in Computer Science and Electronics Engineering (CSEE 2014), 08-09 March, 2014, Kuala Lumpur, Malaysia. : [б.и.], 2014. P. 150-154.
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs. The actual test validation through IR thermal measurement is demonstrated for all types of components. ...
Added: May 15, 2014
IEEE, 2017
This 23rd edition of THERMINIC is again the main European event for
academics and industry to share recent advances in thermal issues of
electronics and microelectronics, including problems of nano-scale heattransfer,
thermal modeling and simulation issues in solid-state lighting as
well as cooling issues of power electronics.
Following the workshops held in Grenoble (1995), Budapest (1996), Cannes
(1997 and 1998), Rome ...
Added: July 16, 2018
Petrosyants K. O., Kharitonov I. A., Rjabov N. et al., , in : Proceedings of IEEE East-West Design & Test Symposium (EWDTS'09). : Х. : Харьковский национальный университет радиоэлектроники, 2009. P. 247-250.
System for thermal design on chip- and board-level of electronic components is introduced. It is integrated with Mentor Graphics CAD and consists of three subsystems: thermal design in IC Station; thermal design in Expedition PCB; thermal measurement for verification of temperature modeling results. ...
Added: March 17, 2013
IEEE, 2018
This 24th edition of THERMINIC is again the main European event for academics and industry to share recent advances in thermal issues of electronics and microelectronics, including problems of nano-scale heat transfer, thermal modeling and simulation issues in solid-state lighting as well as cooling issues of power electronics.
The 24th THERMINIC Workshop will once more propose ...
Added: November 22, 2018
Aminev D., Manohin A., Semenenko A. N. et al., Прикаспийский журнал: управление и высокие технологии 2015 № 1(29) С. 108-117
Authors are proved need of contact control methods application of electronic means elements when carrying out thermal diagnosing in the closed constructive volume. The method of the error calculation brought by the sensor at measurement of element temperature is described. In article topological thermal models of electronic component mounted on the printed circuit board and ...
Added: December 10, 2014
Barcelona : IEEE, 2017
International Conference on Control, Decision and Information Technologies. ...
Added: January 17, 2018
Гурарий М. М., Жаров М. М., Прокопенко Н. Н. et al., Журнал радиоэлектроники 2018 № 4 С. 7
Обсуждается применение оптимизационных методов для решения задачи определения параметров аналоговых микросхем (АМ) в процессе их проектирования. Приводятся постановки оптимизационной задачи и методики ее решения для двух классов АМ – быстродействующих операционных усилителей и линейных компенсационных стабилизаторов напряжения с непрерывным регулированием (КСН). Выбор данных классов АМ обусловлен их широким распространением, наличием противоречивых проектных требований, которые влияют ...
Added: July 12, 2018
Kravchenko N., Mukhin S., Presnyakov S., Journal of Communications Technology and Electronics 2017 Vol. 62 No. 7 P. 800-808
Models of rectangular and axially symmetric resonator slow-wave structures, which are built using transmission matrix for determining the characteristics of the slow-wave structures in different operation modes, are investigated. Elements of the transmission matrix are determined from the results of 3D simulation with the use of the HFSS software. In the analysis of the dispersion ...
Added: October 24, 2017
Тярин А. С., Тронин С. С., Kureev A. et al., Информационные процессы 2023 Т. 23 № 4 С. 497-506
Reconfigurable Intelligent Surfaces (RISs) are promising devices capable of increasing the bandwidth and coverage area of new and existing wireless networks. Nowadays, most of these devices are presented in the form of prototypes that have no environmental protection and are not adapted for implementation in existing communication systems. However, protective coating may significantly affect the ...
Added: January 17, 2024
Mäkitalo N., Ometov A., Kannisto J. et al., IEEE Software 2018 Vol. 35 No. 1 P. 30-37
System design where cyber-physical applications are securely coordinated from the cloud may simplify the development process. However, all private data are then pushed to these remote “swamps,” and human users lose actual control as compared to when the applications are executed directly on their devices. At the same time, computing at the network edge is ...
Added: March 13, 2018
Mamontov A. V., Nefedov V. N., Simonov V., T-Comm: Телекоммуникации и транспорт 2014 Т. 8 № 10 С. 53-55
Theoretical and experimental research results in the field of highly effective rod material's with low thermal conductivity microwave heat treatment technologies are presented. Rods made of polymeric composite materials are used as reinforcement in construction industry. Proposed microwave throughout the volume uniform heating method of the dielectric rod removes the internal thermal stresses in the ...
Added: February 13, 2015
Tumanov M., Системный администратор 2017 № 2 С. 1-8
Исследовано влияние переменного запздвания а качесво процессов управления. ...
Added: October 26, 2017
Natalja P. Kravchenko, Sergey V. Mukhin, Semyon A. Presnyakov et al., T-Comm: Telecommunications and transport 2016 Vol. 10 No. 8 P. 83-88
In this paper the slow-wave structures and their models, which are used for development of the millimeter range devices, are considered. The travelling-wave tubes (TWTs) of the millimeter range use rectangular and axially-symmetric resonator slow-wave structures. Analysis of these slow-wave structures was performed using HFSS program for 3D-modeling [1]. Dispersion characteristics were calculated by program ...
Added: September 15, 2016
Ермилов А. И., Ivashov E., Международный журнал экспериментального образования 2014 № 1 С. 98-101
Devices of nanorelocation with the probes, the executing operations necessary for formation of quantum points are developed. Options of execution of devices are shown. ...
Added: January 20, 2014
Golubiatnikov V. A., Lysenko A. P., Белов А. Г. et al., Известия высших учебных заведений. Электроника 2015 Т. 20 № 6 С. 576-581
The galvanomagnetic Van der Pau measurements were carried out on monocrystalline CdXHg1-XTe (MCT) samples and epitaxial CdXHg1-XTe/Cd1-YZnYTe (MCT/CZT) heterostructures (X 0,2) at T = 295 K and T = 77 K. The sample along with the cryostat rotated in magnetic field of electromagnet by (0 - 3600) – angle with 6-degree step. Angular dependencies ...
Added: May 14, 2015
Azov G. A., Khritkin S. A., Journal of Communications Technology and Electronics 2012 Vol. 57 No. 6 P. 624-628
A numerical simulator of the interaction processes in helical traveling-wave tubes is developed on the basis of the method of large particles in the 1D approximation with the use of the calculation methods developed previously. The output characteristics (frequency dependences of the output power and gain factor) of high-power traveling wave tubes based on helical ...
Added: February 25, 2014
Garces A., Azhmyakov V., IFAC-PapersOnLine 2020 Vol. 53 No. 2 P. 13173-13177
This paper deals with an application of the nested convex programming to the optimal power flow (OPF) in multi-terminal high-voltage direct-current grids (MT-HVDC). The real-world optimization problem under consideration is non-convex. This fact implies some possible inconsistencies of the conventional numerical minimization algorithms (such as interior point method). Moreover, the constructive numerical treatment of this ...
Added: October 30, 2021
Mamontov A. V., Nefedov V. N., Электронная техника. Серия 1: СВЧ-техника 2013 № 4 С. 209-217
Рассмотрено СВЧ – устройство для формирования равномерного распределения температуры в листовых диэлектрических материалах с различными электрофизическими параметрами. СВЧ – устройство построено на основе сочетания систем волноводного типа и замедляющих систем. Приведены результаты измерений распределения температуры по ширине и толщине листовых материалов в СВЧ – устройствах типа бегущей волны на частоте колебаний электромагнитного поля 2450 МГц. ...
Added: January 29, 2014
Зеленоград : МИЭТ, 2013
В сборнике тезисов докладов 20-й Всероссийской межвузовской научно-технической конференции "Микроэлектроника и информатика 2013", которая проводится в год 55-летия образования г. Зеленограда, признанного в стране и мире центра микроэлектроники и нанотехнологий, представлены результаты научных исследований студентов, аспирантов и молодых ученых зеленоградских предприятий и вузов России по следующим приоритетным направлениям развития науки и техники микро- и наноэлектроника, ...
Added: May 31, 2013
Казанцев Д. В., Казанцева Е. А., Кузнецов Е. В. et al., Известия РАН. Серия физическая 2017 Т. 81 № 12 С. 1709-1714
Описаны принципы работы безапертурного сканирующего микроскопа ближнего оптического поля (ASNOM). Зондом в приборе служит металлизированная игла атомно-силового микроскопа, и оптическое взаимодействие с объектами на поверхности локализовано вблизи ее острия размером в несколько нанометров. Тело иглы имеет длину в несколько микрон, и это обеспечивает высокую эффективность ее электромагнитного взаимодействия с падающими на нее извне и излучаемыми ...
Added: December 6, 2020