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Regular version of the site

Book chapter

Thermal Design System for Chip- and Board-level Electronic Components

P. 247-250.
Petrosyants K. O., Kharitonov I. A., Rjabov N., Kozynko P.

System for thermal design on chip- and board-level of electronic components is introduced. It is integrated with Mentor Graphics CAD and consists of three subsystems: thermal design in IC Station; thermal design in Expedition PCB; thermal measurement for verification of temperature modeling results.

In book

Thermal Design System for Chip- and Board-level Electronic Components
Х.: Харьковский национальный университет радиоэлектроники, 2009.