Multi-level Thermal Design of Electronic Components: from Submicron Devices and ICs to Systems on a Board
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of:
1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs.
The actual test validation using IR thermal measurement is demonstrated for all types of components.
SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and
systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of
knowledge between thermal engineers, professionals and leading experts from industry as well as the exchange of information on the
latest academic and industrial advances in electronics thermal management.
System for thermal design on chip- and board-level of electronic components is introduced. It is integrated with Mentor Graphics CAD and consists of three subsystems: thermal design in IC Station; thermal design in Expedition PCB; thermal measurement for verification of temperature modeling results.
Automatic electro-thermal analysis is included into Mentor Graphics PCB Design System. New software tool named TransPower is introduced to couple the electrical (Analog Designer) and thermal (BETAsoft) simulators. The design procedure is fully automated, human errors are eliminated, simulation time is significantly decreased, while accuracy and reliability are increased.
Three types of copper traces for PCBs were investigated: 1) 2.5 μm thin film lines (Ti;Cu;Ni) on aluminium and ceramic (Al2O3) substrates; 2) 2.5 μm thin film lines (Ti;Cu;Ni;Au) on ceramic (Al2O3) substrates; 3) 15 μm traces (Cu;Ni) on polyimide substrate for high density interconnection PCBs. The width of all types of traces was varying in the range of 100-500 μm. The set of temperature-current diagrams for different PCB scenarios are presented and analyzed. The temperature caused by Joule heating was measured using IR camera Flir A40 with macrolens. For different cases the current was set in the range of 0.1-3 A; the measured temperature was in the range of 20-140 oC. The close agreement between the results measured and simulated with ELCUT software tool was achieved.
Automated electro-thermal analysis is realized in the last version of Mentor Graphics PCB Design System. The special software tool AETA is developed and integrated into the Expedition Enterprise PCB Design System to automate the process of power-temperature traffic between electrical and thermal simulators. Furthermore AETA provides the graphical user interface and the possibility to use the different versions of Mentor Graphics software.
For the first time in the domestic technical literature questions of designing of system of power delivery network (PDN) of electronic modules of electronic equipment are considered. Noise in the power supply system of high-speed digital modules are one of the basic problems without which decision working capacity of modules cannot be guaranteed. These decisions should be based on deep physical understanding of the processes occurring in the power supply system of digital modules, the analysis of sources of noise and methods of their suppression, the account of features of traditional and new componental base and outcomes, and also specificity of topological designing of multilayered printed-circuit boards. In the book the listed questions are in details considered, the scientifically-proved recommendations on design of printing modules of digital equipment are given. The statement is accompanied by the big number of examples and numerical calculations. The stated material has a practical orientation and is focused, first of all, on developers and designers of electronic equipment. The book will be useful to the technical experts occupied in research, industrial and other spheres of creation of electronic means. It is possible to recommend the edition as the manual to bachelors, masters and post-graduate students of corresponding directions of preparation.