Multi-level Thermal Design of Electronic Components: from Submicron Devices and ICs to Systems on a Board

P. 330–333.

Petrosyants K. O., Kozynko P., Kharitonov I. A., Rjabov N.

The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.

Keywords: информационные системы, экспериментальные исследования, электронные компоненты, electronic components, thermal design, electro-thermal design, semiconductor devices, monolithic and hybrid ICs, MCM, PCB, multi-level approach, тепловой режим, тепловое проектирование, электро-тепловое проектирование, дискретные полупроводниковые элементы, многокристальные модули, печатные платы

In book

Proceedings of IEEE East-West Design & Test Symposium (EWDTS’10)

Kharkov: Kharkov national university of radioelectronics, 2010.