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Regular version of the site

Book chapter

Multi-level Thermal Design of Electronic Components: from Submicron Devices and ICs to Systems on a Board

P. 330-333.
Petrosyants K. O., Kozynko P., Kharitonov I. A., Rjabov N.

The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.

In book

Multi-level Thermal Design of Electronic Components: from Submicron Devices and ICs to Systems on a Board
Edited by: S. Chumachenko, E. Litvinova. Kharkov: Kharkov national university of radioelectronics, 2010.