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Regular version of the site

Book chapter

Hardware-Software Subsystem for Multilevel Thermal Fault Detection and Analysis of Electronic Components

P. 1-6.
Petrosyants K. O., Kharitonov I. A., Nikita I. Ryabov, Kozynko P. A., Boris G. Lvov.

A hardware-software subsystem for multilevel investigation and analysis of thermal behavior and thermal faults in electronic components and systems is presented. IR thermography and thermal simulation software tools were interconnected and used together to detect and analyze hot spots, overheated elements, to optimize component constructions and cooling conditions to prevent radio-electronic components faults, improve thermal stability and reliability of electronic products for communications purposes. The examples for active devices and passive traces, IC chips, PCBs demonstrate the subsystem efficiency in thermally enhanced design for different applications.