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Статья

Multilevel System for Thermal Design, Control and Management of Electronic Components

The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D  constructions of:

1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs.

The actual test validation using IR thermal measurement is demonstrated for all types of components.