Accelerated Simulation of Thermal and Mechanical Reliability of Electronic Devices and Circuits

М. : PrintLETO.ru, 2013.

Шалумов А. С., Pershin E. O.

Научный редактор перевода: A. A. Korkin

The monograph presents results by professor Dr. A. Shalumov’s Research School of Modeling, Information Technology and Automated Systems (Russia). The program, ASONIKA, developed by the school is reviewed here regarding reliability and quality of devices for simulation of electronics and chips during harmonic and random vibration, single and multiple impacts, linear acceleration and acoustic noise, and steady-state and transient thermal effects. Calculations are done for thermal stress during changes in temperature and power in time. Calculations are done for number of cycles to fatigue failure under mechanical loads as well as under cyclic thermal effects. Simulation results for reliability analysis are taken into account. Models, software interface, and simulation examples are presented.

For engineers and scientists involved in design automation of electronics.

Ключевые слова: reliability, thermal effects, simulation, power, CHIPS, models, impact, temperature, electronics, ASONIKA, vibration, linear acceleration, acoustic noise, thermal stress, fatigue failure, software interface

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