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Method of Electro-Thermal Modeling of Electronic Equipment Using the Compensation Theorem
P. 1–5.
Yury N. Kofanov, Stepan I. Frolov, Svetlana Y. Sotnikova, , in: 2024 International Seminar on Electron Devices Design and Production (SED).: IEEE, 2024. P. 1–6.
Added: October 31, 2024
Kodzoev M., Isachenko S., Bobrova E. et al., , in: XXIII International Scientific Conference on Advance in Civil Engineering: CONSTRUCTION "THE FORMATION OF LIVING ENVIRONMENT" 2020 23-26 September 2020, Hanoi, Vietnam.: Hà Nội: IOP Publishing, 2020. Ch. 1.
Abstract. The energy efficiency concept incorporates energy conservation and durability components involved in the operation of buildings and cost considerations pertaining to the manufacturing and installation of materials. Ceramic brickwork offers the highest reliability and durability category, is not combustible and in terms of these parameters has advantages over other insulated facade cladding systems. Improving ...
Added: March 21, 2023
Evidence-Based Modeling of Thermal Processes in Printed Circuit Assemblies of Optoelectronic Devices
Kofanov Y. N., Kuznetsov N., Sotnikova S., , in: Proceedings of the 2021 IEEE International Conference "Quality Management, Transport and Information Security, Information Technologies" (IT&QM&IS).: IEEE, 2021. P. 439–442.
Added: January 4, 2022
Kuznetsov N., Kofanov Y. N., , in: Proceedings of the 2021 IEEE International Conference "Quality Management, Transport and Information Security, Information Technologies" (IT&QM&IS).: IEEE, 2021. P. 443–447.
Taking into account the functional and design features of optoelectronic devices, this paper proposes to divide the process of developing their thermal macromodels into several stages related to the idealization of the design and the purpose of isothermal volumes. The authors also considered the principle of transition to topological thermal models of structural elements of an ...
Added: January 4, 2022
Kuznetsov E. V., Golyaev Y. D., Zemlyanov M. M. et al., , in: 2021 International Seminar on Electron Devices Design and Production (SED).: IEEE, 2021. P. 1–4.
The article studies the mutual influence of electrical and thermal processes due to their simultaneous occurrence in the printed circuit assemblies of optoelectronic devices (OEDs) in real operating conditions. An increase in the accuracy of computer modeling of electrical and thermal processes can be achieved by switching from the separate modeling of these processes used ...
Added: July 21, 2021
Kofanov Y. N., Grachev N. N., Sotnikova S., , in: Proceedings of the 2020 IEEE International Conference "Quality Management, Transport and Information Security, Information Technologies" (IT&QM&IS).: IEEE, 2020. P. 372–376.
The authors propose a new method for increasing the reliability of radio-electronic equipment, which involves obtaining deterministic reserves for thermal and associated electrical and mechanical loads of electrical components. These reserves should be used as additional indicators for calculating probabilistic reliability indicators at enterprises. The currently used method of calculating using only probabilistic laws of ...
Added: January 25, 2021
Kechiev L., Технологии электромагнитной совместимости 2020 № 1(72) С. 18–30
The issues of designing electronic equipment at the present stage of development of electronic tools are considered. The most urgent design tasks are highlighted: ensuring signal integrity, ensuring power integrity, electromagnetic compatibility. The solution to these problems requires developers and designers to have a deeper understanding of the electrophysical processes that occur during the propagation ...
Added: May 20, 2020
Kuznetsov E., Kolbas Y., Kofanov Y. N. et al., , in: Computational and Experimental Simulations in Engineering. Proceedings of ICCES2019Vol. 75.: Cham: Springer, 2020. P. 295–299.
Modern and advanced electronic equipment is developing along the way of miniaturization of electronic devices (EDs) and increasing their package density, accompanied by growth of heat emission. At the same time, EDs are continuously required to become more reliable and trouble-free.
In this paper we use the generally accepted definition of EDs as devices which operate ...
Added: January 16, 2020
Kofanov Y. N., Sotnikova S. Y., Sargsyan G. A., , in: Proceedings of the 2019 IEEE International Conference "Quality Management, Transport and Information Security, Information Technologies" (IT&QM&IS).: IEEE, 2019. P. 264–267.
In the projects of space electronics, because of its constant complication, the existing methods of the Foresight involving qualified specialist designers of electronic equipment as experts, no longer provide guaranteed solutions for ensuring important reliability indicators. In this paper, the authors propose to select computer programs and carry out comprehensive modeling to increase the efficiency ...
Added: January 9, 2020
Kofanov Y. N., Rotkevich A., Sotnikova S., , in: Proceedings of the 2019 IEEE International Conference "Quality Management, Transport and Information Security, Information Technologies" (IT&QM&IS).: IEEE, 2019. P. 268–272.
In this paper the authors describe an algorithm for ensuring the accuracy of radio electronic devices operating in conditions of extended ambient temperature ranges. A mathematical apparatus for taking into account the coefficients of heat loads on electronic components is presented when analyzing their technological deviations. The purpose of this work is to create an ...
Added: January 9, 2020
Madera A. G., Journal of Engineering and Applied Sciences 2019 Vol. 14 No. 23 P. 8786–8796
Thermal processes in electronic systems are stochastic and nonlinear. The stochasticity of thermal processes in electronic systems can be caused by both external stochastic environmental factors and internal stochastic factors of the electronic systems. Methods existing in the literature allow modeling thermal processes caused only by external stochastic factors. At the same time, there are ...
Added: November 6, 2019
Madera A. G., Journal of Engineering Thermophysics 2017 Vol. 26 No. 1 P. 29–38
Mathematical and computer modeling of thermal processes, applied presently in thermal design of electronic systems, is based on the assumption that the factors determining the thermal processes are completely known and uniquely determined, that is, they are deterministic. Meanwhile, practice shows that the determining factors are of indeterminate interval-stochastic character. Moreover, thermal processes in electronic ...
Added: October 29, 2018
Madera A. G., Journal of Engineering Thermophysics 2017 Vol. 26 No. 1 P. 17–28
Mathematical and computer modeling of the thermal processes, applied presently in thermal design of electronic systems, is based on the assumption that the factors determining the thermal processes are completely known and uniquely determined, that is, they are deterministic. Meanwhile, practice shows that the determining factors are of indeterminate interval-stochastic character. Moreover, thermal processes in ...
Added: October 29, 2018
Petrosyants K. O., Батаруева Е. И., Rjabov N., Вестник Рязанского государственного радиотехнического университета 2017 № 4 (выпуск 62) С. 89–94
General purpose of this work is development of program tools for delay modeling in LSI interconnections with account for thermal effects. Authors use the interconnection model in the form of distributed RC-circuit, which parameters depends on the chip surface temperature distribution. The chip surface temperature is calculated by program tool “Overheat-MC”. Interconnection model parameters – ...
Added: January 23, 2018
Kofanov Y. N., Sotnikova S., , in: Proceedings of the 2016 IEEE Conference on Quality Management, Transport and Information Security, Information Technologies (IT&MQ&IS-2016).: St. Petersburg: IEEE, 2016. P. 90–93.
In paper the authors consider creation of a sensitivity model for complex model of the interdependent electric, thermal and mechanical processes proceeding in an electronic equipment. The sensitivity model is formed by means of the principle of additional models creation. Use of complex model gives the chance to receive sensitivity functions of a process submodel ...
Added: December 16, 2016
Kofanov Y. N., Sotnikova S., Subbotin S. A., , in: Proceedings of the 2016 IEEE Conference on Quality Management, Transport and Information Security, Information Technologies (IT&MQ&IS-2016).: St. Petersburg: IEEE, 2016. P. 94–98.
The paper is discussing a method of increasing the reliability of on-board electronic equipment at the early stages of its design. Authors offer to evaluate and provide deterministic reserves for thermal, mechanical and electrical loads to electronic components using special simulation software. Determinacy of reserves loads on the electronic components is achieved by a result ...
Added: December 10, 2016
Kofanov Y. N., Sotnikova S., Lemanskiy D. A., , in: Innovative Information Technologies: Materials of the International scientific–practical conference. Part 2* 2.: M.: HSE, 2014. P. 616–620.
The paper is devoted to the development of a new method for computer modelling accuracy increase in case of the circuit and designer project decisions making. The original idea of joint consideration of electric, thermal and mechanical processes mathematical models with the physical model presented in the form of the representative fragment design of electronic ...
Added: March 10, 2015
Громов И. Ю., Kozhevnikov A., Системный администратор 2014 № 7-8 С. 139–143
The article discusses the thermal model of Peltier element and a heat pipe intended for inclusion in the overall thermal model design of electronic equipment to optimize system parameters to ensure its thermal regime. Models are constructed on the basis of experimental data of the manufacturer and contain the minimum number of adjustable parameters. ...
Added: March 6, 2015
Zhadnov V. V., Качество. Инновации. Образование 2014 № 10 С. 35–41
The article considers the issues of estimating the temperature tolerances of housings radio electronic elements mounted on the circuit board. Describes the methods of calculation of tolerances and key ratios calculated. The expediency of application of the Monte-Carlo method for calculation of tolerances temperature corps radio electronic elements mounted on the circuit board. ...
Added: November 25, 2014
Zhadnov V. V., Лушпа И. Л., Информационные технологии в проектировании и производстве 2014 № 4 С. 17–23
The article considers the questions assessing the reliability of mechanical components used in the electronic equipment in the early stages of design. The calculations of failure rates springs shock absorbers according to various methods. It is shown that the use of models failure rates of mechanical elements, taking into account the peculiarities of their structural ...
Added: November 13, 2014