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Method of Computer Simulation of Thermal Processes to Ensure the Laser Gyros Stable Operation
Modern and advanced electronic equipment is developing along the way of miniaturization of electronic devices (EDs) and increasing their package density, accompanied by growth of heat emission. At the same time, EDs are continuously required to become more reliable and trouble-free.
In this paper we use the generally accepted definition of EDs as devices which operate utilizing electrical, thermal, optical or acoustic phenomena. One of such devices is a laser gyro (LG), composed of angular rotation sensors on ring lasers, and electronics to provide their functioning and signal processing.
In recent years, thermal simulation is being used in the designing of EDs in order to create competitive equipment in the shortest possible time and at the lowest possible cost. It allows to check thermal calculations and to optimize the design at the early stages of projecting, to reduce the time of testing of developed devices and to exclude redesigning caused by pre-calculation errors.
Analysis of thermal processes in complex multi-boards assemblies of stack and cassette types with large number of electronic components (ECs) is particularly challenging. Especial problems appear when Russian engineers design a system of complex interconnected EDs for space rocket which launch several geophysical and communication satellites onto the Earth orbit. Such EDs include up to 1 million ECs with a dense package on printed circuit boards (PCBs) operating in a wide temperature range. There are many foreign software systems (SSs) for analysis of thermal processes in mechanical engineering. Much fewer SSs are able to simulate thermal processes in electronics. But none of them can be applied in Russia for the several reasons. First, descriptions of these SSs have no information on the analysis of thermal processes in the complex EDs featuring PCBs assemblies of stack and cassette types. Second, the use of foreign SSs will require their adaptation to the component database and typical designs used in Russia, as well as to Russian design standards.
Consequently, high price of foreign SSs and time required for their adaptation will significantly increase cost and time of development.
It is noteworthy that foreign literature does not provide any information on simulation of the distribution of thermal fields in 3-axis LG with electronics.
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