Analysis and Simulation of Temperature-Current Rise in Modern PCB Traces

K. O. Petrosyants; A. V. Kortunov; I. A. Kharitonov; N. Rjabov

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Analysis and Simulation of Temperature-Current Rise in Modern PCB Traces

P. 308–311.

Petrosyants K. O., Kortunov A. V., Kharitonov I. A., Попов А. А., Гоманилова Н. Б., Rjabov N.

The temperature-current rise in modern (up to 100-150 microns wide) PCB traces is simulated using three software tools ANSYS, HyperLynxThermal and ELCUT. The results are compared with the IR measurements in PCB copper traces with different sizes and substrate materials. It is shown that ANSYS correctly describes the thermal behavior for all tests, other tools have some limitations for small size traces.

Language: English

Full text

Keywords: ELCUT PCB Traces ANSYS HyperLynxThermal ELCUT temperature-current rise Дорожки печатных плат ANSYS HyperLynxThermal температурный рост тока

Publication based on the results of:

Development of the methods for multilevel research and simulation of modern temperature and radiation hardened microelectronic components from material level to circuit level (2013)

In book

Proceedings of IEEE East-West Design & Test Symposium (EWDTS’13)

Kharkov: Kharkov national university of radioelectronics, 2013.

Experimental investigation of temperature-current rise in fine PCB copper traces on polyimide, aluminium and ceramic (Al2O3) substrates

Petrosyants K. O., Popov A. A., Advanced Materials Research 2013 Vol. 739 P. 155–160

Three types of copper traces for PCBs were investigated: 1) 2.5 μm thin film lines (Ti;Cu;Ni) on aluminium and ceramic (Al2O3) substrates; 2) 2.5 μm thin film lines (Ti;Cu;Ni;Au) on ceramic (Al2O3) substrates; 3) 15 μm traces (Cu;Ni) on polyimide substrate for high density interconnection PCBs. The width of all types of traces was varying ...

Added: January 23, 2014