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Logi-Thermal Analysis of Digital Circuits Using Mixed-Signal Simulator Questa ADMS

P. 541–544.
Petrosyants K. O., Rjabov N.

CAD sybsystem for logi-thermal analysis of the digital circuits is presented. Logical circuits are described by VHDL language. Thermal regimes are calculated by electro-thermal analogy method. For the calculation of the thermal resistances and capacitances the thermal 3D simulator Overheat-IC based on semi-analytical solution of three-dimensional heat conduction equation is used. For simultaneous calculation of logical and thermal characteristics of IC analog and mixed-signal simulator Questa ADMS is used.

Language: English
Full text
Keywords: CAD sybsystemlogi-thermal analysisdigital ICVHDL languageelectro-thermal analogyheat equationsemi-analytical solutionanalog and mixed-signal simulator Questa ADMSподсистема САПРлогико-тепловой анализлогические ИСязык VHDLметод электро-тепловой аналогииуравнение теплопроводностиполуаналитическое решениеаналоговый и смешанно-сигнальный симулятор Questa ADMS

In book

Proceedings of IEEE East-West Design & Test Symposium (EWDTS’12)
Proceedings of IEEE East-West Design & Test Symposium (EWDTS’12)
Kharkov: Kharkov national university of radioelectronics, 2012.
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