System for thermal design on chip- and board-level of electronic components is introduced. It is integrated with Mentor Graphics CAD and consists of three subsystems: thermal design in IC Station; thermal design in Expedition PCB; thermal measurement for verification of temperature modeling results.
Automatic electro-thermal analysis is included into Mentor Graphics PCB Design System. The method of simultaneous iteration is used for board-level electro-thermal simulation. New software tool named TransPower is introduced to couple the electrical (Analog Designer) and thermal (BETAsoft) simulators. The design procedure is fully automated, human errors are eliminated, simulation time is significantly decreased, while accuracy and reliability are increased.