ТЭРМИД РЭС – экспериментально расчетный комплекс теплового моделирования и тепловизионной дефектоскопии радиоэлектронных средств
The paper describes the approach to the diagnosis of printed circuit assemblies, based on preliminary modeling of thermal processes. Given the condition of uniqueness of defects in the diagnostic process. Shows the effect of manufacturing defects on the change of the printed circuit assemblies thermal field and how using the simulation resulting thermogram, to form the base of the fault
Three types of copper traces for PCBs were investigated: 1) 2.5 μm thin film lines (Ti;Cu;Ni) on aluminium and ceramic (Al2O3) substrates; 2) 2.5 μm thin film lines (Ti;Cu;Ni;Au) on ceramic (Al2O3) substrates; 3) 15 μm traces (Cu;Ni) on polyimide substrate for high density interconnection PCBs. The width of all types of traces was varying in the range of 100-500 μm. The set of temperature-current diagrams for different PCB scenarios are presented and analyzed. The temperature caused by Joule heating was measured using IR camera Flir A40 with macrolens. For different cases the current was set in the range of 0.1-3 A; the measured temperature was in the range of 20-140 oC. The close agreement between the results measured and simulated with ELCUT software tool was achieved.