Modification of thin oxide films of MOS structure by high-field injection and irradiation
We have investigated processes of modification and changing of the charge state of MOS structures having a multilayer gate dielectric based on a thermal SiO2 film doped with phosphorus under conditions of different modes of high-field electron injection and an electron irradiation. We have determined that negative charge, accumulating in the phosphosilicate glass (PSG) ultra thin film of the MOS structures having the two-layer gate dielectric SiO2-PSG under conditions of both high-field tunneling injection of electrons and electron beam, could be used for a modification of devices having the same structure (e.g. correction of threshold voltage, increase of charge stability and breakdown voltage of MOS structure). We have shown that when thickness of PSG film increased, a raising of the electron traps density occurred, but the value of the cross-section of electron traps was the same. It was established that in order to obtain MOS structures with high thermal stability, one has to anneal them at 200° C after performing irradiation treatment.