Analysis and stability ensuring of electronic structures to thermal influences (ASONIKA-T)
Subsystem ASONIKA-T can operate in standalone mode or as part of ASONIKA in combination with other subsystems. Subsystem
ASONIKA-T is designed to automate the modeling of thermal processes such as micro assemblies, radiators, heat-removing bases, hybrid-integrated modules, power cordwood structure, cabinets, racks, and atypical (arbitrary) structures electronics.
Subsystem ASONIKA-T can operate in standalone mode or as part of ASONIKA in combination with other subsystems. Subsystem ASONIKA-T is designed to automate the modeling of thermal processes such as micro assemblies, radiators, heat-removing bases, hybrid-integrated modules, power cordwood structure, cabinets, racks, and atypical (arbitrary) structures electronics.
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.
In the article are esteemed assigning and main capabilities of the subsystem of the analysis and maintenance of thermal values of designs of radio electronic means ASONIKA-T, and also principles of simulation of thermal processes in designs with the help of the subsystem ASONIKA-T. The example of simulation of thermal processes in a standard design is adduced.
Software-hardware subsystem for IR temperature control and measurement has been developed for the different types of electronic components: semiconductor devices, chips, PCBs, units. IR measuring part includes: Flir ThermoVision A40 infrared camera with 17 mkm macro lens, Quantum Focus Instruments Corp InfraScope, precision positioning system and set of thermocouples. Software part for IR data processing includes two standard tools: ThermaCAM Researcher, NEC San-ei Image Processor and several original software tools for extension of the subsystem abilities. The examples of thermal management for semiconductor devices, chips, PCBs and units are presented.
This volume presents new results in the study and optimization of information transmission models in telecommunication networks using different approaches, mainly based on theiries of queueing systems and queueing networks .
The paper provides a number of proposed draft operational guidelines for technology measurement and includes a number of tentative technology definitions to be used for statistical purposes, principles for identification and classification of potentially growing technology areas, suggestions on the survey strategies and indicators. These are the key components of an internationally harmonized framework for collecting and interpreting technology data that would need to be further developed through a broader consultation process. A summary of definitions of technology already available in OECD manuals and the stocktaking results are provided in the Annex section.