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Analysis and Simulation of Temperature-Current Rise in Modern PCB Traces

P. 308-311.
Petrosyants K. O., Kortunov A. V., Kharitonov I. A., Попов А. А., Гоманилова Н. Б., Rjabov N.

The temperature-current rise in modern (up to 100-150 microns wide) PCB traces is simulated using three software tools ANSYS, HyperLynxThermal and ELCUT. The results are compared with the IR measurements in PCB copper traces with different sizes and substrate materials. It is shown that ANSYS correctly describes the thermal behavior for all tests, other tools have some limitations for small size traces.

В книге

Под науч. редакцией: V. Hahanov. Kharkov: Kharkov national university of radioelectronics, 2013.