Simulation Of Reliability For Electronic Means With Regard To Temperature Fields
The paper considers the technique of modeling of electronic reliability based on modeling electrical components environment temperature. As experience of the simulation and exploitation of electronic shows, one of the main factors that significantly affect the reliability characteristics is the thermal effect. This is confirmed by the statistics of a number of companies. In the paper for the simulation were used systems ASONIKA-K and ASONIKA-TM. On the example of a real electronic mean proved the need for a point temperature estimate for each electrical component and the account of these temperatures, instead of the average values in predicting the reliability indices. Such approach will significantly improve (20% -40%) the accuracy of estimates of the mean time to failure. Developed engineering method to predict reliability, built on the ”downward" hierarchical circuit simulation.