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TCAD-SPICE Investigation of SEU Sensitivity for SOI and DSOI CMOS SRAM Cells in Temperature Range up to 300 °C

Ch. 15. P. 31–34.
Petrosyants K., D.A. Popov, Li B., Wang Y.

The simulation results received by mixed TCAD-SPICE modeling for linear energy transfer (LET), transient characteristics of voltages and currents in 0.24 um SRAM cells with SOI, DSOI and SELBOX structures in temperature range up to 300 °C were analyzed. It was shown that the fault tolerance of CMOS SOI SRAM cells can be increased when DSOI MOSFETs are used instead of traditional SOI MOSFETs.

Language: English
Full text
Keywords: TCAD-SPICE simulationTCAD-SPICE моделированиеодиночные сбоивысокая температураhigh temperatureDSOIsingle event upsetDSOISELBOXSELBOX

In book

Proceedings of the 3nd International Conference on Microelectronic Devices and Technologies (MicDAT 2020)
Barcelona: International Frequency Sensor Association (IFSA), 2020.
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