Специализированные модели теплового процесса радиоаппаратуры подсистемы АСОНИКА-Т
The article considers the questions assessing the reliability of mechanical components used in the electronic equipment in the early stages of design. The calculations of failure rates springs shock absorbers according to various methods. It is shown that the use of models failure rates of mechanical elements, taking into account the peculiarities of their structural and technological performance, not only allows us to solve the problem of calculating, but also to ensure the required level of reliability and mechanical components, and containing electronic equipment.
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.