The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.
This paper presents method that allow to extend computer-aided design of radio-electronic devices and to automate choosing process of thermal regime and temperature control systems for electronic chips and entire device. That process both structural and parametrical optimization is determined as a thermal regime system synthesis. We consider various classes of on-board aerospace and mobile military devices sensitive to mass and dimension. The study proposed a new optimal design criterion of thermal regime systems and suggested mathematical expediency estimation rank for every parameter changing on every optimization step.