The Implementation of the Cross-Cutting Design Technique of Electronic Communication Modules Using National Instruments Technologies
The modern level of technological advance allows the use of CAD systems at all the stages of the electronic communication modules development, which allows the designers to discard the time-consuming process of manufacturing and testing an experimental prototype. To organize the interaction of various CADs the design techniques are used. The report discusses the integrated cross-cutting design technique implemented using National Instruments software products. Their advantages and disadvantages are evaluated. The use of the NI LabView made it possible to implement a dynamic calculation of reliability indicators through the use of NI LabView Multisim Connectivity Toolkit, which confirmed the possibility of realization an integrated cross-cutting design technique.
The considered model of the failure rate of CMOS VHSIC design proposed in the article Piskun G.A., Alekseev V.F., "Improvement of mathematical models calculating of CMOS VLSIC taking into account features of impact of electrostatic discharge", published in the first issue of the journal "Technologies of electromagnetic compatibility" for the year 2016. It is shown that the authors claim that this model "...will more accurately assess the reliability of CMOS VHSIC design" is fundamentally flawed and its application will inevitably lead to inadequate results. Alternatively, the proposed model of the failure rate of CMOS VHSIC design, which also allows to take into account the views of ESD, but based on the use of resistance characteristics of CMOS VHSIC to the effects of ESD.
Mathematical models of failure rate of refusals the elements applied in calculations of reliability of the onboard electronic equipment are considered. Possibility of application the models given in foreign standards, for forecasting of reliability of completing elements is shown.
The basic influencing the factor defining its reliability are temperature influences at which speed of chemical reaction of materials a part REE increases. It is represented the equation which has been received by the Swedish chemist Svante Arreniusom from thermodynamic reasons
The article considers the questions assessing the reliability of mechanical components used in the electronic equipment in the early stages of design. The calculations of failure rates springs shock absorbers according to various methods. It is shown that the use of models failure rates of mechanical elements, taking into account the peculiarities of their structural and technological performance, not only allows us to solve the problem of calculating, but also to ensure the required level of reliability and mechanical components, and containing electronic equipment.
The main target of the IEEE East-West Design & Test Symposium (EWDTS-2013) is to exchange experiences between scientists and technologies of Eastern and Western Europe, as well as North America and other parts of the world, in the field of design, design automation and test of electronic circuits and systems. EWDTS’13 covers the following topics:
• Analog, Mixed-Signal and RF Test
• Analysis and Optimization
• EDA Tools for Design and Test
• Failure Analysis, Defect and Fault
• Modeling & Fault Simulation
• Power Issues in Testing
• Reliability of Digital Systems
• Thermal, Timing and Electrostatic Analysis of SoCs and Systems on Board
Maintenance of reliability of radio-electronic equipment taking into account thermal modes for various classes of electroradioproducts (ERP) within the limits of system ASONIKA is considered.
The monograph presents results by professor Dr. A. Shalumov’s Research School of Modeling, Information Technology and Automated Systems (Russia). The program, ASONIKA, developed by the school is reviewed here regarding reliability and quality of devices for simulation of electronics and chips during harmonic and random vibration, single and multiple impacts, linear acceleration and acoustic noise, and steady-state and transient thermal effects. Calculations are done for thermal stress during changes in temperature and power in time. Calculations are done for number of cycles to fatigue failure under mechanical loads as well as under cyclic thermal effects. Simulation results for reliability analysis are taken into account. Models, software interface, and simulation examples are presented.
For engineers and scientists involved in design automation of electronics.
These are the proceedings of the International Workshop on Petri Nets and Software Engineering (PNSE’13) and the International Workshop on Modeling and Business Environments (ModBE’13) in Milano, Italy, June 24–25, 2013. These are co-located events of Petri Nets 2013, the 34th international conference on Applications and Theory of Petri Nets and Concurrency.
PNSE'13 presents the use of Petri Nets (P/T-Nets, Coloured Petri Nets and extensions) in the formal process of software engineering, covering modelling, validation, and veriﬁcation, as well as their application and tools supporting the disciplines mentioned above.
ModBE’13 provides a forum for researchers from interested communities to investigate, experience, compare, contrast and discuss solutions for modeling in business environments with Petri nets and other modeling techniques.