Non-destructive Testing of Electronic Components Overheating Using Infrared Thermography
Software-hardware IR thermography subsystem for non-destructive testing of electronic components overheating has been developed. IR measuring part included: Flir ThermoVision A40 infrared camera with 17 mkm macro lens, Quantum Focus Instruments Corp InfraScope, precise positioning system. Software part for IR data processing included two standard tools: ThermaCAM Researcher, NEC San-ei Image Processor and several original software tools for extension of the subsystem abilities. The sets of examples are presented to illustrate the efficiency of using IR thermography measuring subsystem for non-destructive testing of electronic components (semiconductor devices, chips, PCBs) to improve thermal stability and reliability of electronic products.