Analysis of temperature-current rise in modern PCB traces by means of thermography
Higher functionality of today’s electronic products demands high density integration of electronic components. In this field, printed-circuit-board (PCB) are the perspective technology to build a variety of electronic systems for different applications. Two types of boards were investigated: high current for power applications and high density boards for modern electronic equipment. The set of IR images and temperature-current diagrams for different substrate materials were investigated. Current and temperature limits for all test boards were defined to provide high level of board relectronic system reliability.