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Regular version of the site

Book chapter

Analysis of temperature-current rise in modern PCB traces by means of thermography

P. 171-174.

Higher functionality of today’s electronic products demands high density integration of electronic components. In this field, printed-circuit-board (PCB) are the perspective technology to build a variety of electronic systems for different applications. Two types of boards were investigated: high current for power applications and high density boards for modern electronic equipment.  The set of IR images and temperature-current diagrams for different substrate materials were investigated. Current and temperature limits for all test boards were defined to provide high level of board relectronic system reliability.

In book

Analysis of temperature-current rise in modern PCB traces by means of thermography
Ronchi L., Moroni D. Piza: CNR-ISTI, Italy; Fondazione “Giorgio Ronchi”, Firenze, 2015.