Проектная оценка надёжности бортовой радиоэлектронной аппаратуры с учётом условий герметизации
For the effective functioning of the onboard avionics, require sealing. Gasket failure rate directly affects the probability of successful operation of the device in a sealed condition. Gasket failure rate, in turn, depends on many factors.
The considered model of the failure rate of CMOS VHSIC design proposed in the article Piskun G.A., Alekseev V.F., "Improvement of mathematical models calculating of CMOS VLSIC taking into account features of impact of electrostatic discharge", published in the first issue of the journal "Technologies of electromagnetic compatibility" for the year 2016. It is shown that the authors claim that this model "...will more accurately assess the reliability of CMOS VHSIC design" is fundamentally flawed and its application will inevitably lead to inadequate results. Alternatively, the proposed model of the failure rate of CMOS VHSIC design, which also allows to take into account the views of ESD, but based on the use of resistance characteristics of CMOS VHSIC to the effects of ESD.
The publication contains materials of the conference dedicated scientific-technical problems in the field of Radioelectronics, telecommunications and computer engineering.
The publication is intended for researchers, engineers and graduate students.
Mathematical models of failure rate of refusals the elements applied in calculations of reliability of the onboard electronic equipment are considered. Possibility of application the models given in foreign standards, for forecasting of reliability of completing elements is shown.
The basic influencing the factor defining its reliability are temperature influences at which speed of chemical reaction of materials a part REE increases. It is represented the equation which has been received by the Swedish chemist Svante Arreniusom from thermodynamic reasons
The article considers the questions assessing the reliability of mechanical components used in the electronic equipment in the early stages of design. The calculations of failure rates springs shock absorbers according to various methods. It is shown that the use of models failure rates of mechanical elements, taking into account the peculiarities of their structural and technological performance, not only allows us to solve the problem of calculating, but also to ensure the required level of reliability and mechanical components, and containing electronic equipment.
Maintenance of reliability of radio-electronic equipment taking into account thermal modes for various classes of electroradioproducts (ERP) within the limits of system ASONIKA is considered.
The monograph presents results by professor Dr. A. Shalumov’s Research School of Modeling, Information Technology and Automated Systems (Russia). The program, ASONIKA, developed by the school is reviewed here regarding reliability and quality of devices for simulation of electronics and chips during harmonic and random vibration, single and multiple impacts, linear acceleration and acoustic noise, and steady-state and transient thermal effects. Calculations are done for thermal stress during changes in temperature and power in time. Calculations are done for number of cycles to fatigue failure under mechanical loads as well as under cyclic thermal effects. Simulation results for reliability analysis are taken into account. Models, software interface, and simulation examples are presented.
For engineers and scientists involved in design automation of electronics.