Book chapter
Незнание закона не освобождает от ответственности!
С. 7-9.
We use cookies in order to improve the quality and usability of the HSE website. More information about the use of cookies is available here, and the regulations on processing personal data can be found here. By continuing to use the site, you hereby confirm that you have been informed of the use of cookies by the HSE website and agree with our rules for processing personal data. You may disable cookies in your browser settings.
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.