Accelerated Simulation of Thermal and Mechanical Reliability of Electronic Devices and Circuits
The monograph presents results by professor Dr. A. Shalumov’s Research School of Modeling, Information Technology and Automated Systems (Russia). The program, ASONIKA, developed by the school is reviewed here regarding reliability and quality of devices for simulation of electronics and chips during harmonic and random vibration, single and multiple impacts, linear acceleration and acoustic noise, and steady-state and transient thermal effects. Calculations are done for thermal stress during changes in temperature and power in time. Calculations are done for number of cycles to fatigue failure under mechanical loads as well as under cyclic thermal effects. Simulation results for reliability analysis are taken into account. Models, software interface, and simulation examples are presented.
For engineers and scientists involved in design automation of electronics.
The considered model of the failure rate of CMOS VHSIC design proposed in the article Piskun G.A., Alekseev V.F., "Improvement of mathematical models calculating of CMOS VLSIC taking into account features of impact of electrostatic discharge", published in the first issue of the journal "Technologies of electromagnetic compatibility" for the year 2016. It is shown that the authors claim that this model "...will more accurately assess the reliability of CMOS VHSIC design" is fundamentally flawed and its application will inevitably lead to inadequate results. Alternatively, the proposed model of the failure rate of CMOS VHSIC design, which also allows to take into account the views of ESD, but based on the use of resistance characteristics of CMOS VHSIC to the effects of ESD.
The article considers the questions assessing the reliability of mechanical components used in the electronic equipment in the early stages of design. The calculations of failure rates springs shock absorbers according to various methods. It is shown that the use of models failure rates of mechanical elements, taking into account the peculiarities of their structural and technological performance, not only allows us to solve the problem of calculating, but also to ensure the required level of reliability and mechanical components, and containing electronic equipment.
In a fast changing global economy governed by Enterprise Services and the Future Internet, enterprises and virtual factories will self-organize in distributed, interoperable, innovation Ecosystems where the issues of Enterprise Interoperability need to be solved in a multi-view of information, services and processes throughout Enterprise Networks.
New quasi – 3D numerical model for thermal analysis of the BGA packages is presented. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distributions in different layers of the package. The complexity and CPU time of the thermal analysis are many times reduced. The results of BGA package thermal modeling are presented.
In the paper integrated information systems for corporate planning and budgeting are considered. Four groups of practical tasks exceeding the bounds of typical functionality of special-purpose planning and budgeting information systems are allocated. Several classes of information systems (simulation, statistical analysis, financial analysis and modeling, group decision making, business intelligence), which may provide the completeness of corporate planning and budgeting are denoted as solutions complementary to special-purpose planning and budgeting systems.
Generalized error-locating codes are discussed. An algorithm for calculation of the upper bound of the probability of erroneous decoding for known code parameters and the input error probability is given. Based on this algorithm, an algorithm for selection of the code parameters for a specified design and input and output error probabilities is constructed. The lower bound of the probability of erroneous decoding is given. Examples of the dependence of the probability of erroneous decoding on the input error probability are given and the behavior of the obtained curves is explained.
The dynamics of a two-component Davydov-Scott (DS) soliton with a small mismatch of the initial location or velocity of the high-frequency (HF) component was investigated within the framework of the Zakharov-type system of two coupled equations for the HF and low-frequency (LF) fields. In this system, the HF field is described by the linear Schrödinger equation with the potential generated by the LF component varying in time and space. The LF component in this system is described by the Korteweg-de Vries equation with a term of quadratic influence of the HF field on the LF field. The frequency of the DS soliton`s component oscillation was found analytically using the balance equation. The perturbed DS soliton was shown to be stable. The analytical results were confirmed by numerical simulations.
Radiation conditions are described for various space regions, radiation-induced effects in spacecraft materials and equipment components are considered and information on theoretical, computational, and experimental methods for studying radiation effects are presented. The peculiarities of radiation effects on nanostructures and some problems related to modeling and radiation testing of such structures are considered.
This volume presents new results in the study and optimization of information transmission models in telecommunication networks using different approaches, mainly based on theiries of queueing systems and queueing networks .
The paper provides a number of proposed draft operational guidelines for technology measurement and includes a number of tentative technology definitions to be used for statistical purposes, principles for identification and classification of potentially growing technology areas, suggestions on the survey strategies and indicators. These are the key components of an internationally harmonized framework for collecting and interpreting technology data that would need to be further developed through a broader consultation process. A summary of definitions of technology already available in OECD manuals and the stocktaking results are provided in the Annex section.