Collection of Papers Presented at the 14th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC 2008)
THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. Thermal management is expected to become an increasingly dominating factor of the cost of the total system. All these trends are calling for thermal simulation, monitoring and cooling. New developments such as the moving parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. In addition, new materials have to be created to assure the manageability of the increased thermal stress and to answer the challenges of the nano-era.
Automatic electro-thermal analysis is included into Mentor Graphics PCB Design System. The method of simultaneous iteration is used for board-level electro-thermal simulation. New software tool named TransPower is introduced to couple the electrical (Analog Designer) and thermal (BETAsoft) simulators. The design procedure is fully automated, human errors are eliminated, simulation time is significantly decreased, while accuracy and reliability are increased.